Find here ic packaging, semiconductor packaging companies, ic packaging companies, packaging design companies, semiconductor assembly, IC package design and ic packaging design services.
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Microelectronic Assembly Services, Electro-Optics and Photonics Assembly Services , Wafer Level Services
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Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Co-development in every stage of your project, Package design & prototyping, Industrialization, Development track record
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Leading Edge Technology 40nm, 28nm, 20nm, Advanced Technology 65nm, 90nm, 0.13um, Application Specific Solutions, Packaging, Testing
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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ASIC Design, Opto, Toll Road, RFID, Sensors, Test and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Turnkey ASIC Design and Manufacture
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
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Turnkey ASIC Supplier, IC Design Services Provider, Application Specific Standard Products (ASSP)
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Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
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Turnkey ASIC Provider, Analog/Mixed-Signal & RF Expertise, Sensors & MEMS, Design Methodology
RF/Wireless, High Voltage DC-DC Converters, Analog Frontends, System Level / Digital IP, Power Management, Data Converters
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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Fast Turn IC Assembly & Packaging, Hi-Rel IC Assembly & Packaging, Flip Chip Assembly, Wire Bonding & Ribbon Bonding, Package Design Services
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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