IC Packaging Services
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Services
Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
IP Cores
Logic Families, Analog
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Services
Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Services
Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Services
Turnkey ASIC, Turnkey Custom Silicon Production, New Product Introduction (NPI), ASIC Design Services, Embedded & Application Software, System Design & Validation
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Services
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Services
Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics
IP Cores
IP Library
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Services
Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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Services
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Services
Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design
IP Cores
RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital
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Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Services
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
IP Cores
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Services
Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Services
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Services
PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Services
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Services
Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
IP Cores
12 bit SAR ADC, Digital temperature sensor
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Services
SoC Design, Supply Chain Management, ASIC Services, FPGA Design
IP Cores
Processor IP, Digital and Analog IP
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