IC Packaging Services
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Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Services
IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
IP Cores
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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Services
Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
IP Cores
12 bit SAR ADC, Digital temperature sensor
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Services
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
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Services
ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
IP Cores
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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Services
Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics
IP Cores
IP Library
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Services
PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Services
Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Services
Turnkey ASIC, Turnkey Custom Silicon Production, New Product Introduction (NPI), ASIC Design Services, Embedded & Application Software, System Design & Validation
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Services
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Services
Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs
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Services
SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
IP Cores
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Services
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Services
Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Services
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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Services
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Services
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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