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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly
IO-Link
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Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Turnkey ASIC Design and Manufacture
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
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Basic Vendor Selection Package, Full Silicon Management Package, Verification Package, Silicon Roadmap Planning Package, Commercial Package, Financing Package
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design
RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital
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PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
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ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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