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Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules
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IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Turnkey ASIC Design and Manufacture
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
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Design Execution, AMS Circuit Design, Reliability & Product Engineering, Embedded Software, Low-Cost ASIC
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly
IO-Link
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Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
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