Find here ic packaging, semiconductor packaging companies, ic packaging companies, packaging design companies, semiconductor assembly, IC package design and ic packaging design services.
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Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas
RF, Analog, Power, Digital
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Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
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ASIC Design Service, Turnkey Service, “YOU” IP portfolio and silicon platform solution
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly
IO-Link
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Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
SiFive HBM2/2E (High Bandwidth Memory) Subsystem IP, SiFive Interlaken IP Core, SiFive PCS (Physical Coding Sublayer) IP, SiFive MCMR FEC (Forward Error Correction) IP Core, SiFive 100G Ethernet PCS IP, SiFive 100G Ethernet MAC IP, SiFive FlexE (Flexible Ethernet) IP, SiFive USB1.1 FS Function Controller, SiFive USB2.0 FS Dual Role Controller, SiFive USB 2.0 Multi-Point USB HS OTG Controller, SiFive USB 2.0 High-Speed Function Controller, SiFive USB3.2 Gen2 single lane Re-Timer IP Core, SiFive USB3.0 DR-OTG Controller IP Cores, SiFive USB3.2 Gen2 IP Core
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RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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