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ASIC and SoC Design, Prototyping and Validation, Production, Packaging, Testing, Product Engineering
Interlaken Core (High Speed Chip-to-Chip Interface), HMC Controllers, MCMR FEC (Forward Error Correction) IP Core, PCS (Physical Coding Sublayer) IP, FlexE (Flexible Ethernet) IP
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ASIC Turn-key, Back-End services, Architecture, Analog and RF, Algorithms, Board Design
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
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