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Greenvity Communications

USA

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

Services

IP Licensing, Mixed-Signal ASIC Design and Customization

IP Cores

HomePlug Green PHY Powerline Communication (HPGP PLC) for Electric Vehicle (EV) Charging System and Automotive, ZigBee Wireless at 2.4GHz, Sub-Gigahz RF Transceiver (programmable 400MHz – 1GHz)

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

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Linwave Technology

UK

Linwave Technology based in the UK offers a range of standard QFN limiter LNAs, detectors and customised multi-chip modules for defence, marine and automotive and industrial applications.

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Teledyne e2v Semiconductors

France

Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.

Services

Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package

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