Find companies providing IC FIB Services
The richest directory of ASIC/IC FIB services worldwide. Find the IC FIB services companies that matches your needs.
13 results found See AllSend Email to All
USA
ACE provides high quality advanced level FIB circuit editing, Dual-Beam imaging and atomic resolution TEM analytical services.
France
HCM.SYSTREL is a semiconductor assembly and test house (back-end services).
Services
Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
View vendor pageUSA
IC Failure Analysis Lab is a full-service provider of Failure Analysis and Qualification services to Semiconductors, Medicals, Telecommunications, and Automotive companies.
Services
Failure Analysis, Reliability and Qualification Testing
View vendor pageUSA
Pacific Microchip Corp. is a privately held IC design company founded in 2006 and headquartered in Los Angeles, California USA.
UK
NanoScope is a European Focused Ion Beam Technology and TEM Microscopy service provider.
Services
Failure Analysis, Circuit Nano-edit, Reliability Testing, FIBxTEM Analysis
View vendor pageCanada and USA
XtremeEDA, founded in 2002, is a North-American based provider of design and verification services for the semiconductor industry.
Services
Digital Design Verification (DV), Digital Microarchitecture, Design, & Implementation, Analog Modeling & Mixed Signal (AMS) Verification
IP Cores
Security & Encryption, Standard Interconnect and Communication Protocols
View vendor pageCanada
Comport Data offers analog, mixed-signal and digital IC design, layout, testing and manufacturing using CMOS, BiCMOS and Bipolar technologies and processes.
Services
Mixed-Signal ASIC Designs Portfolio, ASIC Design, ASIC Testing, Products, Comport Data, Comport Data Contact Form
View vendor pageUK
Fast Turn IC Packaging (Same Day Turn Around Possible) & High Performance IC Packaging for Space & Other Hi-Rel Applications.
Services
Fast Turn IC Assembly & Packaging, Hi-Rel IC Assembly & Packaging, Flip Chip Assembly, Wire Bonding & Ribbon Bonding, Package Design Services
View vendor pageUSA
Our core focus is to provide customers with semiconductor IC testing services they need. Such as ESD & LU testing, Burn-In & Product Reliability, Package Qualifications , Test Hardware and Manufacturing and ATE testing.
Services
IC Qualifications for ESD, Burn-in product, process, Reliability Qualification capability and capacity, Device Package Qualification Services including Preconditioning, Engineering and Hardware capabilities, IC Package Failure Analysis
View vendor pageUSA
EAG's Microelectronics Test and Engineering team provides semiconductor and electronics design firms with test, debug, and early engineering support for new product introduction.
Services
ATE Test and Engineering, Burn-In & Reliability Qualification Services, ESD Testing & Latch-Up Testing Services, PCB Design & Assembly Services, FIB Circuit Edit and Debug Services, Failure Analysis Services
View vendor page 
