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Today’s News

• Exploring Heterogeneous Integration (HI)
• Micross Acquires Integra Technologies, Establishing Top U.S. OSAT Provider
• onsemi Boosts Power Portfolio for AI Data Centers with Silicon Carbide JFET Acquisition
• ESD Alliance Reports $5.1 Billion Revenue for Q3 2024 in Electronic System Design
• High-Performance 16-Bit ADC/DAC IP Cores Available for Licensing

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• Understanding Heterogeneous Integration (HI)
• Micross Acquires Integra Technologies, Creating the Leading U.S. Domiciled OSAT Provider
• onsemi Acquires Silicon Carbide JFET Technology to Enhance Its Power Portfolio for AI Data Centers
• Introduction to Chip Scale Packaging
• Semiconductor Trends Shaping 2025

• The Ultimate Guide to Gate-All-Around (GAA)
• Building a Fabless Semiconductor Business: A Practical Guide
• MosChip® Technologies joins Renesas RZ Partner Ecosystem as AI/ML Design Partner
• A Guide to BCD, CMOS, FinFET, SOI, GaN and SiC
• Worldwide Silicon Wafer Shipments Increase 7% in Q2 2024, SEMI Reports

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