IC Package Design

The richest directory of IC Package Design worldwide. Find the IC Package Design that matches your needs.

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Triad Semiconductor

USA

Turnkey analog/mixed-signal ASIC solutions (design & manufacture). Agile IC tech to get your IC to profits quickly.

Services

Turnkey ASIC Design and Manufacture

IP Cores

Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)

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MegaChips Technology America Corporation

USA

MegaChips is a trusted partner, delivering technology and expertise that enable products uniquely designed for people and engineered for performances.

Services

RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services

IP Cores

Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor

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PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

Services

PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules

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KERR

Italy

KERR srl is an R&D company which core business is the ASIC supply chain service provider.

Services

Turnkey Solutions - Supply Chain Management Services, ASIC Definition, FPGA to ASIC, Destructred Turnkey Services, Algorithms, System in Package

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Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests

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EquipIC Supply Chain

The Netherlands

ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.

Services

Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain

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Brite Semiconductor

China

Brite Semiconductor is a world-leading ASIC design solution provider, targeting ULSI ASIC/SoC chip design on SMIC advanced 55nm/40nm/28nm/14nm process technology and turn-key solutions.

Services

ASIC Design Service, Turnkey Service, “YOU” IP portfolio and silicon platform solution

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VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

Services

Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis

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Alphacore

USA

Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.

Services

IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services

IP Cores

Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors

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ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

Services

ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas

IP Cores

RF, Analog, Power, Digital

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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Tekmos

USA

Tekmos provides low cost ASICs, efficiently matching fab technology to your application. Digital, mixed signal, and high voltage ASICs.

Services

Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers

IP Cores

80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family

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SiFive

USA

SiFive provides System-Optimized ASIC Solutions from Concept to Volume Production. Also, SiFive offers a wide-portfolio RISC-V Processor IP Cores and SoC IPs.

Services

Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management

IP Cores

SiFive HBM2/2E (High Bandwidth Memory) Subsystem IP, SiFive Interlaken IP Core, SiFive PCS (Physical Coding Sublayer) IP, SiFive MCMR FEC (Forward Error Correction) IP Core, SiFive 100G Ethernet PCS IP, SiFive 100G Ethernet MAC IP, SiFive FlexE (Flexible Ethernet) IP, SiFive USB1.1 FS Function Controller, SiFive USB2.0 FS Dual Role Controller, SiFive USB 2.0 Multi-Point USB HS OTG Controller, SiFive USB 2.0 High-Speed Function Controller, SiFive USB3.2 Gen2 single lane Re-Timer IP Core, SiFive USB3.0 DR-OTG Controller IP Cores, SiFive USB3.2 Gen2 IP Core

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Beckermus Technologies

Israel

Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.

Services

Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services

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HCM.SYSTREL

France

HCM.SYSTREL is a semiconductor assembly and test house (back-end services).

Services

Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis

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Majelac Technologies

USA

Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)

Services

QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping

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Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies

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Sigenics

USA

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

Services

Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing

IP Cores

Logic Families, Analog

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