IC Package Design
The richest directory of IC Package Design worldwide. Find the IC Package Design that matches your needs.
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Services
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Services
Turnkey ASIC Design & Supply, IC Design Services, Supply Chain Management, ASIC Industrialization, Design and Implementation Expertise
IP Cores
ASIC Reference Designs , Analog, Encryption and authentication , Digital
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Services
Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design
IP Cores
RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital
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Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Services
Analog / Mixed Signal ASIC Design, Circuit Design, Back-End Services, Custom PDK and PCELL, Low Cost ASIC or ASSP, Smart Integrated Power
IP Cores
Analog Signal Path IP (Amplifiers, ADCs, DACs, LDOs)
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Services
Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Services
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
IP Cores
RFID analog front-end
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Services
Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
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Services
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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Services
Basic Vendor Selection Package, Full Silicon Management Package, Verification Package, Silicon Roadmap Planning Package, Commercial Package, Financing Package
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Services
Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
IP Cores
Logic Families, Analog
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Services
Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Services
Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
IP Cores
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
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Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Services
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Services
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Services
Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
IP Cores
Column ADC Patent, Extensive IP Library
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Services
IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
IP Cores
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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Services
Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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