The richest directory of IC Package worldwide. Find the IC Package that matches your needs.
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly
IO-Link
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Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services
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Turnkey ASIC Provider, Analog/Mixed-Signal & RF Expertise, Sensors & MEMS, Design Methodology
RF/Wireless, High Voltage DC-DC Converters, Analog Frontends, System Level / Digital IP, Power Management, Data Converters
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Chip Design and Development, Implementation, Turnkey solutions, Speciality Services
12 bit SAR ADC, Digital temperature sensor
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
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ASIC Design Services & Implementation, ASIC turnkey Operation , Crypto Coin & Block Chain ASIC , Supply Chain Management , RF & Mixed Signal, IP Design and Licensing
1.6GHz Phase-Locked-Loop (PLL) , 6.5Gbps Multiprotocol SERDES PHY (GF 65nm), 12.5Gbps Multiprotocol SERDES PHY (GF 40nm), 1.6GHz Phase-Locked-Loop (PLL) (GF 65nm), Multi-Protocol Physical Coding Sublayer (PCS)
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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ASIC Design, Testing and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
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Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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