The richest directory of IC Package worldwide. Find the IC Package that matches your needs.
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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ASIC Design Service, Turnkey Service, “YOU” IP portfolio and silicon platform solution
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ASIC Design, Testing and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive PCS (Physical Coding Sublayer) IP, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 100G Ethernet PCS IP, OpenFive 100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB1.1 FS Function Controller, OpenFive USB2.0 FS Dual Role Controller, OpenFive USB 2.0 Multi-Point USB HS OTG Controller, OpenFive USB 2.0 High-Speed Function Controller, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core
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Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
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Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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ASIC Design Services, IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas
RF, Analog, Power, Digital
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Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly
IO-Link
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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