IC package
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Services
Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Services
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
IP Cores
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Services
Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
IP Cores
OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP
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Services
Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
IP Cores
Logic Families, Analog
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Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Services
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Services
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
IP Cores
RFID analog front-end
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Services
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
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Services
Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics
IP Cores
IP Library
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Services
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Services
Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
IP Cores
Column ADC Patent, Extensive IP Library
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Services
ASIC Design, Package Design
IP Cores
PLL Synthesizers, Front-End Modules (Transmitters, Receivers, Transceivers), Voltage Controlled Oscillators (VCOs), Power Amplifiers (PAs), Low Noise Amplifiers (LNAs), Bandgap Voltage Reference (BGR), Voltage Regulators, Analog to Digital Converters (ADCs)
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Services
Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Services
Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
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Services
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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Services
Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs
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