IC package
The richest directory of IC Package worldwide. Find the IC Package that matches your needs.
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Israel
EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.
Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
View vendor pageUSA
Turnkey analog/mixed-signal ASIC solutions (design & manufacture). Agile IC tech to get your IC to profits quickly.
Services
Turnkey ASIC Design and Manufacture
IP Cores
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
View vendor pageBelgium
Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.
More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.
Services
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
View vendor pageThe Netherlands
Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.
Services
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
View vendor pageIsrael
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Services
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageGermany
AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.
Services
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
View vendor pageUSA
Cactus Semiconductor is a full-service provider of low-power mixed-signal ASICs specializing in miniaturized portable and implantable medical devices.
Services
Turnkey ASIC Supplier, IC Design Services Provider, Application Specific Standard Products (ASSP)
View vendor pageUSA
Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.
Services
Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
View vendor pageUSA
Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)
Services
QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
View vendor pageUK
EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.
Services
SoC Design, Supply Chain Management, ASIC Services, FPGA Design
IP Cores
Processor IP, Digital and Analog IP
View vendor pageSweden
Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.
Services
ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas
IP Cores
RF, Analog, Power, Digital
View vendor pageSweden
MAK AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies.
Services
Microelectronic Assembly, Encapsulation and potting, Engineering Services
View vendor pageThe Netherlands
ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.
Services
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
View vendor pageUSA
asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.
Services
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
IP Cores
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
View vendor pageUSA
SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.
Services
Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services
View vendor pageUSA
Tekmos provides low cost ASICs, efficiently matching fab technology to your application. Digital, mixed signal, and high voltage ASICs.
Services
Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
IP Cores
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
View vendor pageSwitzerland
HMT is a designer and supplier for robust or low-noise mixed signal ASICs, primarily for sensors and actuators.
Services
Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly
IP Cores
IO-Link
View vendor pageUSA
MegaChips is a trusted partner, delivering technology and expertise that enable products uniquely designed for people and engineered for performances.
Services
RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
IP Cores
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
View vendor pageSingapore
Global Wafer Test Service provider. Services include Test Program Development and Platform migration, Optimization, Yield Improvement, Laser Dicing, Stud Bump.
Services
Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services
View vendor pageCanada
IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.
Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
View vendor page 
