The richest directory of Integrated Circuit Packaging worldwide. Find the Integrated Circuit Packaging Suppliers that matches your needs.
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IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management
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ASIC Design Service, Turnkey Service, “YOU” IP portfolio and silicon platform solution
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
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Turnkey ASIC Supplier, IC Design Services Provider, Application Specific Standard Products (ASSP)
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Turnkey Solutions - Supply Chain Management Services, ASIC Definition, FPGA to ASIC, Destructred Turnkey Services, Algorithms, System in Package
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Turnkey ASIC Design and Manufacture
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
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ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas
RF, Analog, Power, Digital
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ASIC Design, Testing and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services
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