Integrated Circuit Packaging

The richest directory of Integrated Circuit Packaging worldwide. Find the Integrated Circuit Packaging Suppliers that matches your needs.

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VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

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Criteria Labs

USA

Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.

Services

Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification

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Sigenics

USA

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

Services

Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing

IP Cores

Logic Families, Analog

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Integra Technologies

USA

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Services

Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials

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Ardentec

Singapore

Global Wafer Test Service provider. Services include Test Program Development and Platform migration, Optimization, Yield Improvement, Laser Dicing, Stud Bump.

Services

Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services

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CustomSilicon.com by Digital Papaya Inc.

USA

CustomSilicon.com is the leading consulting firm in the custom silicon strategy and project management space for AR/VR, automotive, mobile, server, crypto, sensors and more.

Services

Basic Vendor Selection Package, Full Silicon Management Package, Verification Package, Silicon Roadmap Planning Package, Commercial Package, Financing Package

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IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

Services

Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis

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Tekmos

USA

Tekmos provides low cost ASICs, efficiently matching fab technology to your application. Digital, mixed signal, and high voltage ASICs.

Services

Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers

IP Cores

80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family

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Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests

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EquipIC Supply Chain

The Netherlands

ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.

Services

Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain

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Majelac Technologies

USA

Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)

Services

QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies

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Caliber Interconnect Solutions

India

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

Services

Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design

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Presto Engineering

France

Presto Engineering, Inc. provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

ASIC Design Services, IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management

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ASIC North

USA

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

Services

ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization

IP Cores

Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator

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AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

Services

Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services

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HMT microelectronic AG

Switzerland

HMT is a designer and supplier for robust or low-noise mixed signal ASICs, primarily for sensors and actuators.

Services

Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly

IP Cores

IO-Link

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Beckermus Technologies

Israel

Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.

Services

Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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