Semiconductor Packaging

The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.

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QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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Sigenics

USA

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

Services

Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing

IP Cores

Logic Families, Analog

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ASIC North

USA

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

Services

ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization

IP Cores

Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator

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Microdul

Switzerland

Microdul AG (ISO9001/ISO13485). Miniaturized Microelectronic Modules, Ultra-Low-Power ASICs (nA, nW) and Thick-Film.

Services

ASIC development & supply, ASIC Industrialization, Modules, Thick-film

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Swindon Silicon Systems

UK

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

Services

Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs

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IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

Services

Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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TES Electronic Solutions

Germany

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Services

ASIC design and supply chain management, ASIC design services

IP Cores

Video and Graphics, Digital IP, Analog IP

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OpenFive

USA

OpenFive provides System-Optimized ASIC Solutions from Concept to Volume Production. Also, OpenFive offers a wide-portfolio RISC-V Processor IP Cores and SoC IPs.

Services

Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management

IP Cores

OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP

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SGA

Sweden

SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.

Services

ASIC Design and Supply, Analog and mixed-signal circuits

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indie Semiconductor FFO

Germany

indie Semiconductor FFO GmbH is a One-Stop-Shop for high-frequency analogue and mixed-signal ASICs. We tailor to the customers’ requirements and specific demands, even for individual quantities.

Services

ASIC Design, Feasibility Studies, Advanced Packaging, Serial Production

IP Cores

RF-Analog

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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SYNERGIE CAD PSC

France

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

Services

Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly

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IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

Services

ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies

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Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests Services

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GF Micro

UK

GF Micro provides turnkey ASIC design and supply solutions for a range of applications including Aerospace, Industrial and Consumer.

Services

Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding

IP Cores

12 bit SAR ADC, Digital temperature sensor

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Presto Engineering

France

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

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Infineon

Germany

Infineon is a world leader in semiconductor solutions, which link the real and the digital world.

Services

Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics

IP Cores

IP Library

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