51 results found
Israel
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Microelectronic Assembly Services, Electro-Optics and Photonics Assembly Services , Wafer Level Services
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Germany
PREMA Semiconductor is specialized in analog and mixed signal ASICs, offering full service from circuit design, IC layout, prototype and volume wafer production to final IC test.
USA
BDI provides the most comprehensive high-speed engineering design, modeling, analysis, measurement, characterization and verification services and solutions.
Package Design, Lab Measurement
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India
SigIntegrity provides design services related to IC package co-design, ASIC co-design, System Signal integrity, Power integrity analysis & Electromagnetic modeling of silicon & package interconnects.
IC Package design, ASIC co-design, Signal Integrity & Power Integrity, Electromagnetic modeling
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