Semiconductor Packaging

Services

Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management

IP Cores

SiFive HBM2/2E (High Bandwidth Memory) Subsystem IP, SiFive Interlaken IP Core, SiFive PCS (Physical Coding Sublayer) IP, SiFive MCMR FEC (Forward Error Correction) IP Core, SiFive 100G Ethernet PCS IP, SiFive 100G Ethernet MAC IP, SiFive FlexE (Flexible Ethernet) IP, SiFive USB1.1 FS Function Controller, SiFive USB2.0 FS Dual Role Controller, SiFive USB 2.0 Multi-Point USB HS OTG Controller, SiFive USB 2.0 High-Speed Function Controller, SiFive USB3.2 Gen2 single lane Re-Timer IP Core, SiFive USB3.0 DR-OTG Controller IP Cores, SiFive USB3.2 Gen2 IP Core

Services

Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials

Services

PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules

Services

ASIC Design, Testing and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

Services

Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers

IP Cores

80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family

Services

Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services

Services

Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing

IP Cores

Logic Families, Analog

Services

ASIC Design Service, Turnkey Service, “YOU” IP portfolio and silicon platform solution

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

Services

Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services

Services

Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

Services

Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

Services

Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain

Services

QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping

Services

IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management

Services

RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services

IP Cores

Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor

Services

Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly

IP Cores

IO-Link

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services