The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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ASIC Design, Testing and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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RTL Design, FPGA to ASIC conversion, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
High-speed ADC/DAC, Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, DisplayPort & HDMI, Processor
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services
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IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services
Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors
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ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas
RF, Analog, Power, Digital
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Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly
IO-Link
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules
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Turnkey ASIC Design and Manufacture
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive PCS (Physical Coding Sublayer) IP, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 100G Ethernet PCS IP, OpenFive 100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB1.1 FS Function Controller, OpenFive USB2.0 FS Dual Role Controller, OpenFive USB 2.0 Multi-Point USB HS OTG Controller, OpenFive USB 2.0 High-Speed Function Controller, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core
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