Semiconductor Packaging
The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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Services
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Services
Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
IP Cores
Logic Families, Analog
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Services
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
IP Cores
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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Services
Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs
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Services
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Services
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Services
ASIC design and supply chain management, ASIC design services
IP Cores
Video and Graphics, Digital IP, Analog IP
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Services
Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management
IP Cores
OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 400/200/100G Ethernet PCS IP, OpenFive 400/200/100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core, OpenFive Die-to-Die Controller IP
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Services
ASIC Design, Feasibility Studies, Advanced Packaging, Serial Production
IP Cores
RF-Analog
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Services
SoC Design, Supply Chain Management, ASIC Services, FPGA Design
IP Cores
Processor IP, Digital and Analog IP
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Services
Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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Services
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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Services
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Services
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Services
Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
IP Cores
12 bit SAR ADC, Digital temperature sensor
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Services
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
IP Cores
RFID analog front-end
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Services
Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics
IP Cores
IP Library
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