Semiconductor Packaging

The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.

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IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

Services

Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis

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DELTA Microelectronics

Denmark

DELTA provides IC design, semiconductor testing, distribution, and complete semiconductor manufacturing services to some of the world’s best known brands.

Services

ASIC Design, Testing and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

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EquipIC Supply Chain

The Netherlands

ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.

Services

Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain

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MegaChips LSI USA Corporation

USA

MegaChips provides high performance high quality ASICs in advanced geometries for 5G macro/small cells and repeater, ultra-low power wireless communications, wired/optical communications, image signal processing and nanopore.

Services

RTL Design, FPGA to ASIC conversion, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services

IP Cores

High-speed ADC/DAC, Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, DisplayPort & HDMI, Processor

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AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

Services

Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services

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Majelac Technologies

USA

Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)

Services

QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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Sigenics

USA

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

Services

Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing

IP Cores

Logic Families, Analog

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Ardentec

Singapore

Global Wafer Test Service provider. Services include Test Program Development and Platform migration, Optimization, Yield Improvement, Laser Dicing, Stud Bump.

Services

Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services

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Alphacore

USA

Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.

Services

IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services

IP Cores

Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors

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ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

Services

ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas

IP Cores

RF, Analog, Power, Digital

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HMT microelectronic AG

Switzerland

HMT is a designer and supplier for robust or low-noise mixed signal ASICs, primarily for sensors and actuators.

Services

Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly

IP Cores

IO-Link

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies

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PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

Services

PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules

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Triad Semiconductor

USA

Turnkey analog/mixed-signal ASIC solutions (design & manufacture). Agile IC tech to get your IC to profits quickly.

Services

Turnkey ASIC Design and Manufacture

IP Cores

Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)

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Criteria Labs

USA

Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.

Services

Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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OpenFive

USA

OpenFive provides System-Optimized ASIC Solutions from Concept to Volume Production. Also, OpenFive offers a wide-portfolio RISC-V Processor IP Cores and SoC IPs.

Services

Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management

IP Cores

OpenFive HBM2/2E (High Bandwidth Memory) Subsystem IP, OpenFive Interlaken IP Core, OpenFive PCS (Physical Coding Sublayer) IP, OpenFive MCMR FEC (Forward Error Correction) IP Core, OpenFive 100G Ethernet PCS IP, OpenFive 100G Ethernet MAC IP, OpenFive FlexE (Flexible Ethernet) IP, OpenFive USB1.1 FS Function Controller, OpenFive USB2.0 FS Dual Role Controller, OpenFive USB 2.0 Multi-Point USB HS OTG Controller, OpenFive USB 2.0 High-Speed Function Controller, OpenFive USB3.2 Gen2 single lane Re-Timer IP Core, OpenFive USB3.0 DR-OTG Controller IP Cores, OpenFive USB3.2 Gen2 IP Core

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Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests

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