The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.
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ASIC Design, Testing and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Chip Design and Development, Implementation, Turnkey solutions, Speciality Services
12 bit SAR ADC, Digital temperature sensor
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Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
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Turnkey ASIC Design and Manufacture
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
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Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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RTL Design, Place and Route with Timing verification, Package Design, Wafer Fabrication, COT Services
Multi-rate SerDes, BroadR-Reach Compliant Ethernet PHY, AFE, DisplayPort, HDMI, Processor
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IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management
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Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Custom Prototype and Process Development, Custom Environmental Life Test and Failure Analysis, Custom Manufacturing Services
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Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
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Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly
IO-Link
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