Semiconductor Packaging

The richest directory Semiconductor Packaging worldwide. Find the Semiconductor Packaging that matches your needs.

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Tekmos

USA

Tekmos provides low cost ASICs, efficiently matching fab technology to your application. Digital, mixed signal, and high voltage ASICs.

Services

Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers

IP Cores

80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family

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Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies

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Alphacore

USA

Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.

Services

IC Design Services, Imaging System Development, IP Design Services , Custom Engineering IC Services, Testing Services

IP Cores

Analog, Mixed-Signal, RF IC’s and IP’s, Imaging Products and IPs, Radiation Hardened Electronics, Power and RF Components and IPs, CyberSecurity & Reliability Monitors

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ASIC North

USA

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

Services

ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization

IP Cores

Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator

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VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Services

SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs

IP Cores

Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP

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PHIX Photonics Assembly

The Netherlands

Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.

Services

PIC Packaging and Assembly, Photonics Contract Manufacturing, Fiber Arrays Available From Stock, Engineering Support for PIC-based Modules

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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Ardentec

Singapore

Global Wafer Test Service provider. Services include Test Program Development and Platform migration, Optimization, Yield Improvement, Laser Dicing, Stud Bump.

Services

Testing Services, Engineering Services before Mass Production, Mass Production Engineering Services, Probe Card Service, IT Web Based Data Services, Quality Services

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ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

Services

ASIC Design, Wireless, Turnkey (Supply Chain Services), Hardware Design, Antennas

IP Cores

RF, Analog, Power, Digital

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Majelac Technologies

USA

Majelac Technologies provides QUICK Turnaround Dicing and IC Assembly Services. QFN, QFP, SOIC, and Ceramic Packages available. (same day service available)

Services

QUICK Turnaround IC Assembly, Wafer Dicing and Sorting, Flip Chip Assembly, Wire Bonding, Ribbon Bonding and Stud Bumping

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Criteria Labs

USA

Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.

Services

Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification

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Integra Technologies

USA

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Services

Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials

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Sigenics

USA

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

Services

Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing

IP Cores

Logic Families, Analog

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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HCM.SYSTREL

France

HCM.SYSTREL is a semiconductor assembly and test house (back-end services).

Services

Wafer Treatment, Assembly Services, Ball / Column Attachment, Hybrids Design and Manufacturing, Full Back-end Turnkey Solution, Environmental Test and Lab Analysis

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SiFive

USA

SiFive provides System-Optimized ASIC Solutions from Concept to Volume Production. Also, SiFive offers a wide-portfolio RISC-V Processor IP Cores and SoC IPs.

Services

Front End Design, Integration and Verification, IP Development and Integration, Physical Design, Wafer Manufacturing, Package and Assembly, Test, Quality and Supply Chain Management

IP Cores

SiFive HBM2/2E (High Bandwidth Memory) Subsystem IP, SiFive Interlaken IP Core, SiFive PCS (Physical Coding Sublayer) IP, SiFive MCMR FEC (Forward Error Correction) IP Core, SiFive 100G Ethernet PCS IP, SiFive 100G Ethernet MAC IP, SiFive FlexE (Flexible Ethernet) IP, SiFive USB1.1 FS Function Controller, SiFive USB2.0 FS Dual Role Controller, SiFive USB 2.0 Multi-Point USB HS OTG Controller, SiFive USB 2.0 High-Speed Function Controller, SiFive USB3.2 Gen2 single lane Re-Timer IP Core, SiFive USB3.0 DR-OTG Controller IP Cores, SiFive USB3.2 Gen2 IP Core

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KERR

Italy

KERR srl is an R&D company which core business is the ASIC supply chain service provider.

Services

Turnkey Solutions - Supply Chain Management Services, ASIC Definition, FPGA to ASIC, Destructred Turnkey Services, Algorithms, System in Package

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IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

Services

ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services

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Beckermus Technologies

Israel

Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.

Services

Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services

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HMT microelectronic AG

Switzerland

HMT is a designer and supplier for robust or low-noise mixed signal ASICs, primarily for sensors and actuators.

Services

Robust ASICs, Low-noise and Micropower ASICs, ASIC qualification (AEC-Q100), certification and failure analysis, Production Test (Zero defect), Miniature Assembly

IP Cores

IO-Link

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