Find here IC testing, semiconductor testing companies, IC testing companies, ASIC test companies, semiconductor testing, wafer test, wafer sort, final test services, wafer probber.
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Leading Edge Technology 40nm, 28nm, 20nm, Advanced Technology 65nm, 90nm, 0.13um, Application Specific Solutions, Packaging, Testing
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ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
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ASIC Design, Opto, Toll Road, RFID, Sensors, Test and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Mixed-Signal ASIC Designs Portfolio, ASIC Design, ASIC Testing, Products, Comport Data, Comport Data Contact Form
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Turnkey ASIC Design and Manufacture
Analog Signal Path IP (Amplifiers, ADCs, DACs, Filters)
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Turnkey ASIC Supplier, IC Design Services Provider, Application Specific Standard Products (ASSP)
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Low Cost ASICs, FPGA Conversions, Unify Stacked Die SIPS, Mixed Signal ASICs, High Temperature Circuits, Mature Microcontrollers
80C51 Family, 68HC(7)05 Family, 68HC(7)11 Family, 80C186 Family, 68020 Family
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Turnkey ASIC Provider, Analog/Mixed-Signal & RF Expertise, Sensors & MEMS, Design Methodology
RF/Wireless, High Voltage DC-DC Converters, Analog Frontends, System Level / Digital IP, Power Management, Data Converters
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Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems
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Integrated Circuit (IC) Design, Full Turn-Key ASIC Supplier, Fabless Manufacturing
Logic Families, Analog
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Mixed-Signal ASICs, Digital ASICs, Wafer Production, IC Packages & Testing , Supply Chain Management
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Fast Turn IC Assembly & Packaging, Hi-Rel IC Assembly & Packaging, Flip Chip Assembly, Wire Bonding & Ribbon Bonding, Package Design Services
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Design Service, Layout Implementation and Verification Service, Pre-Silicon Validation Service, ASIC Testing Service
Low-Power Low-PhaseNoise VCO 1.5-1.9 GHz
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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IoT Operations Outsourcing Solutions, Secured IC Provisioning , RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, Supply Chain Management
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Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
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Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
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