Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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IP Provider, IO Design, Consulting and testing services
Low Voltage ESD/EOS protection (up to 5V), HV/BCD EOS/ESD protection (5V and higher), LIN PHY (transceiver) , Programmable Clipping Circuit for Antenna pins, Power-on-Reset Circuit, Radiation Hard, ESD robust Level Shifters
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ASIC Services, Mixed Signal Services, Spec-in / Turnkey Services
High Speed Serdes solutions, High end, high speed ADC/DAC, Low-Power, Cost-Effective 8- and 16-bit MCUs, Video, Image & Data Compression, MIPI, RF
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Taming the Complexity of ASIC Design, Sophisticated Packaging Expertise, Custom Memory IP and I/Os, The Right Partner for the Right Chip, Test Engineering, Optimize Yield, Product Cost and Performance Metrics
Custom Memory IP and I/Os, High-Bandwidth Memory (HBM) Solutions, TCAMs and BCAMs: Ternary and Binary Content-Addressable Memory Compilers, Register-File Memory Compilers, High-Speed Single-Port Cache Memories, Interface IP
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General-Purpose I/O (GPIO), ESD Protection , High-speed I/O, Memory Interfaces, Special
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