Japan
TOPPAN Technical Design Center Inc. (TDC) is a premier semiconductor design and turnkey solution provider with over 50 years of IC development expertise. We specialize in analog and digital mixed-signal design, offering flexible one-stop solutions from specification design to mass production. Our core offerings include comprehensive ASIC and Power Semiconductor Turnkey Services. By leveraging strong partnerships with diverse foundries and OSATs—including our status as a TSMC Value Chain Alliance (VCA), X-FAB Premium Design Partner, and Arm Approved Design Partner—we guarantee secure, high-quality manufacturing.
TDC focuses on Industrial Equipment, Motor Control applications, and Physical AI. We excel in co-creating optimal custom ICs, integrating power semiconductors, MCUs, and high-precision analog CMOS to reduce cost and PCB size. With our global presence, including dedicated contact offices at TOPPAN Europe and TOPPAN America, we seamlessly support international projects. Whether you need a full turnkey flow, partial design support, or EOL management, TDC is your dedicated partner for reliable silicon innovation.
We provide turnkey, total solution services tailored to our customers’ specifications, from initial circuit design to ASIC prototyping and seamless volume production, including comprehensive mass production management. In analog technology, we offer wireless communication, high-speed transmission, sensor circuits, and power management circuits. For digital technology, we excel in effectively reducing power consumption to optimize performance.
Leveraging our extensive network of global partners, we satisfy diverse customer needs for high-quality, custom ASIC development.
MPW and MP Foundry Partners:
– TSMC
– DB HiTek
– X-FAB
– SMIC
– GlobalFoundries
– Japan Semiconductor
– UMC
– Tower Semiconductor
– Vanguard International Semiconductor Corporation (VIS)
– PSMC
Applications (Mass Production & In Development):
Battery Control IC, IC for Rotary Encoder (with built-in 12-bit ADC), Infrared Sensor, FA Equipment Controller, Ultrasonic Transceiver, Pattern Generator, Communication IC, Capacitive Sensor, Gyro Sensor (with built-in 16-bit ADC), 192ch-Switch IC for Probe Cards, ToF Sensor, GNSS Receiver for Wearable Devices, Inverter Control MCU, Motor Control MCU, Motor Driver, Geomagnetic Sensor
We have been providing premium ASIC development and design services for over 50 years. Our development experience includes a wide variety of technological fields, such as analog, memory, LCD/LED drivers, and microcomputer logic. As for the development of analog mixed-signal in particular, we pride ourselves on top-class technical know-how in the industry, backed by our accumulated technologies including power circuits, amplifiers, high-frequency ASICs, and system ASIC digital mixed macros.
LSI design achievements:
SoC:
– MPU/MCU equipped with ARM Cortex-M0/M3/M7
– RISC-V equipped MCU
– AI accelerator
High Speed Interface:
– IEEE Standard LVDS (~1Gbps)
– MIPI D-PHY for CMOS Image sensors (~2Gbps)
– PLL for high-speed PHY
RF:
– Sub-GHz RF front-end
– GPS RF front-end
– PLC RF front-end
Power Management:
– Single-channel power ICs（DC-DC, Charge Pump, LDO）
– Multi-channel power ICs
– Driver ICs (LDD, LED, LCD)
Sensor AFE (Analog Front End):
– Various ADCs
– Magnetic sensor AFE
– Infrared sensor AFE
– Image sensor AFE
Mixed-Signal:
– Wireless power feeding system control ICs
– Base-band ICs for 3D-compatible smartphones
– Monitor controller ICs
We provide turnkey services of power semiconductors where it is difficult to secure wafer manufacturing capacity, for example industrial equipment, factory automation, and other applications.
In addition to total solution services from design to packaging and mass production, we can also undertake wafer manufacturing.
We also offer porting of wafer manufacturing processes owned by device manufacturers and contract services for partial processing.
Using this service enables a stable supply of a wide variety of small-lot products.
Device Line-up & Power Modules:
– FS-IGBT / RC-IGBT / High-Voltage IGBT
– FRD (Fast Recovery Diode) / SBD (Schottky Barrier Diode)
– High-Voltage MOSFET / SJ-MOSFET (Super Junction)
– SiC-MOSFET (Silicon Carbide)
– Customized Power Modules