RoodMicrotec

RoodMicrotec offers a one-stop shop for semiconductor manufacturing, from wafer procurement to shipment of tested finished products.

As well as our test engineering, qualification and failure analysis services, our services include:

Wafer sourcing

Wafer probe (up to 12”) inking and/or wafermap

Wafer grinding and dicing

Packaging/assembly

Burn-in, qualification, reliability

Final test

Shipment in tray, tube or tape & reel

Work in Progress monitoring, tracking and reporting

Inventory Management

Logistics Support

Customs clearance/assistance

RoodMicrotec endeavors to support its customers through the complete “concept to final tested parts” process. Our highly experienced experts are available at all times through the process to ensure a smooth and successful project.

We develop test software for optimal and efficient test of semiconductor wafers and packaged devices. We also offer support for for optoelectronic semiconductors such as image sensors, photo diodes, Opto-ASICs.

Customers benefit from engineering support from qualification to volume production:

• development of test concepts
• development of test software and hardware
• characterization
• test program conversion
• modification and optimisation of test solutions, e.g. test time reduction

electrical test for qualification and failure analysis

Product Qualification and Environmental Tests

product qualification = advanced long-time reliability = minimization of failure costs

We perform customer specific qualifications and according to standards such as AEC-Q100/101/200, ESCC 9020/9010, MIL-STD 883/202, JEDEC 020, TELCORDIA GR 468/1221/326/1312, IEC 60 068-2-XX and DIN.

• definition of test concept and qualification plans
• life-test, burn-in and run-in
• HAST (highly accellerated stress test) and pressure cooker
• environmental test, ESD test
• (opto)electrical characterization
• physical layout analysis
• solderability tests and solder profile qualification
• RoHS-compliance, e.g. definition and check of moisture sensitivity level (MSL)

Environmental Simulation and Accelerated Aging

climatic tests:

• -70 °C up to +300 °C and between 10% and 98% relative humidity (constant/ cyclic/ shock)
• pressure cooker and HAST

mechanical tests:

• shock, vibration (sinus/ random) and bump

Electronical measurements, qualification and failure analysis

Expert knowledge for different optoelectronic devices such as LEDs, laser diodes, image sensors, fibre optic devices and entire optical systems.

Optoelectronic services include:

• selection of LEDs respective definition of chromaticity coordinate:
  parameter such as XY-coordinate, dominant and peak wavelength, spectral curve

• life test an burn-in of LEDs and laser diodes with online-measurement
• check of heat allocation and heat dissipation
• radiation characteristics (check of data sheet)
• eye safety measurement for LEDs/ classification
• risk assessment of new technologies

Failure Analysis on LEDs:

• visual inspection to detect mechanical faults, corrosion or contamination
• measuring of various optoelectric and electric parameters such as spectrum, radiant characteristics, leakage current, thermal resistance
• SAM (scanning acoustic microscopy), X-ray and X-sectioning to detect cracks and delaminations/check of solder joints and bond connections
• special preparation and failure analysis on chip level (crystal structure)

Approval and analyses for various applications such as aerospace, general lighting, industry electronics, medical equipment and automotive.

Failure and Technology Analysis

Failure analyses in order to clarify the failure cause as soon as possible.
From single device to the whole system – and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).

Electrical and Functional Failure Analysis

• functional check on devices, printed board assemblies (PBAs), modules and systems
• verification of functionality
• circuit analysis
• failure simulation and reproduction
• optoelectronic and vehicle specific measurements

Physical Failure Analysis

• Focused Ion Beam (FIB)
• X-ray and scanning acoustic microscopy
• light optical and scanning electron microscopy
• chemical and mechanical decapsulation
• failure localisation with emission microscopy and liquid crystal thermography
• reverse processing (wet and dry etching)
• metallographic cross-sectioning
• mounting- and material analysis
• solder joint assessment

risk analysis and recommendation of corrective actions

Semiconductor Test

Testng regarding function, electrical and optoelectronic parameters

Electrical test of wafer up to 12“ and packaged devices – selection and volume test

• functional test in 3 temperature ranges with test systems of Advantest (93k), Credence, Teradyne, Verigy
• high flexibility for various package types
• clean room conditions up to class 1000

Device Programming

• For programmable logic, e.g. Flash, OTP´s, Eproms, µController with embedded flash
• Variety of packages

Full automation programming facilitates laser marking and reeling in one work step.

End-of-Line Service

• scanning and straightening of electronic devices
• tape & reel, dry-pack (moisture barrier bag)

shipment to end customer worldwide