TAIPRO is your partner for electronic design & manufacture able to start from idea to production.
We engineer microsystems & develop their microassembly processes (packaging). TAIPRO Engineering provides the prototypes, pre-production, medium and ramp-up series.
An accredited clean room, high-tech packaging equipment and deep knowledge of all packaging techniques are the keys for driving the development of your innovative solutions.
TAIPRO Engineering’s offer can be summarized in 3 main strategic axes:
- Full development project based on a functional and/or technical specification: feasibility studies – Proof of concept / prototype / demonstrator –small and ramp-up production series;
- Packaging design, support, prototyping for front-end and back-end sectors which need specific support before manufacturing: feasibility studies, support for packaging choices (wire bonds, die attach, solder paste, substrate, package…), demonstration and characterization, prototypes,
- Production of small and medium series including (COB, SiP, MCM,…)
