Switzerland
Microdul is an MBO of Philips Semiconductors Zürich and was founded in 1991. We are ISO9001:2015 and ISO13485: 2016 certified and more than half of our business is in the medical sector. We have three business lines, Module, Semiconductors and Thick-film. Our Semiconductors group develops and supplies custom (ASIC), mixed-signal, ultra-low-power (nA and nW) solutions and standard products to the market. We have strong experience in providing solutions for timing (especially 32kHz), capacitive and temperature sensing, and power management particularly energy harvesting. We take responsibility for design, test, assembly, logistics, and quality. We are able to offer a wide variety of package options including plastic, die, flip-chip or chip-scale packaging.
Microdul is an expert in the manufacture of high-quality micro-modules including class III medical modules. About two-thirds of our business is in medical modules. Our core competences are the miniaturization of modules and the processing of bare dies. We first gained ISO13485 certification in 2003 and over the years, we have gained a lot of experience in the medical field. We provide a manufacturing service to many well-known medical companies. Our process competencies include, module layout, die attach, wire bonding (gold or aluminum), pick & place, solder, glob-top and inspection for example. Our experience covers ultra-small package technologies like flip-chip and chip-scale package.
If you prefer to design your own ASIC, Microdul can offer the possibility to industrialize it by providing wafer purchasing, assembly, test and qualification services conforming to ISO9001 or ISO13485. We are able to offer a wide variety of package options including plastic, die, flip-chip or chip-scale packaging.
Microdul is an expert in the manufacture of high-quality micro-modules including class III medical modules. About two-thirds of our business is in medical modules. Our core competences are the miniaturization of modules and the processing of bare dies. We first gained ISO13485 certification in 2003 and over the years, we have gained a lot of experience in the medical field. We provide a manufacturing service to many well-known medical companies. Our process competencies include, module layout, die attach, wire bonding (gold or aluminum), pick & place, solder, glob-top and inspection for example. Our experience covers ultra-small package technologies like flip-chip and chip-scale package.
Thick-film technology allows conductive, resistive and isolating layers to be screen printed on substrates. Typically, layers are printed on to ceramic substrates. Although this is not a leading edge technology, it does have its uses when it comes to sensors because ceramic is an extremely stable material and usually sensors work best when the substrate is stable. If you are looking for thick-film, then try us.
