Majelac Technologies provides Semiconductor Assembly and Packaging services. We specialize in QUICK turnaround IC packaging. (Same Day Service is available)
We offer
- Wafer Dicing (up to 300mm), MPW wafers, Individual Die Dicing
- Epoxy Die Attach, Eutectic Die Attach, and Solder Die Attach
- Gold Ball Wire Bonding
- Aluminum Wedge Bonding
- Copper Wire Bonding
- Gold Ribbon Bonding
- Stud Bumping
- Heavy Wire Bonding (4 mil to 20 mil wire)
- Flip Chip Attach (Solder, Thermo Sonic, Thermo Compression)
- Encapsulation and Over molding
- BGA Ball Attach
- BGA Reballing
- MEMS packaging
Our Package capabilities include QFN, SOIC, QFP, Open Cavity packages, CPGA, PPGA, Sidebraze Dip, BGA, FCBGA, MAP type QFN, Chip on Board COB, and custom packages.
