Micross

USA

Micross logo

Micross is a provider of advanced, high-reliability microelectronic products and services. With broad authorized access to die & wafer suppliers, an extensive portfolio of hi-rel power, RF, optoelectronics, memory, data bus, logic, and SMD/5962 qualified products, and comprehensive advanced packaging, assembly, modification, upscreening, and test capabilities, Micross is uniquely positioned to provide differentiated high-reliability solutions, from bare die, to fully packaged devices including hermetic ICs/MCMs, PEMs, ASICs, FPGAs, and PCBs, to complete program lifecycle sustainment. For more than 45 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets. For more information about Micross, please visit www.micross.com and follow us on LinkedIn.

Services

Test and Qualification

Micross’ advanced testing facilities provides more than 40 years of component and product testing expertise to meet critical program and application needs.

Our core engineering and manufacturing strengths provide advanced solutions in areas such as environmental testing, electrical test, and specialty packaging, as well as component, board and reliability qualification testing services.

 

  • Up-Screening
  • Space-Grade Up-Screening
  • Mil-Grade Up-Screening
  • Electrical Testing
  • Device Characterization
  • RF
  • High-Speed Digital
  • Wafer Probe
  • Tester Rental
  • Environmental Testing
  • Component Qualification
  • Board Level Qualification
  • ESD Characterization
  • Reliability Testing
  • Burn-In
  • Mechanical

OSAT

Micross has been the backbone of the aerospace, defense, space, medical, automotive, and communications sectors, delivering the most comprehensive suite of microelectronic products and services globally. As a DMEA DoD Trusted Source OSAT provider, Micross empowers U.S.-based electronics manufacturers to sidestep risks, bypass delays, and cut additional costs.

Die Prep

  • Wafer Thinning and Dicing
  • Die Plating/Customized Output
  • Visual Inspection
  • Lot Acceptance Testing

Assembly

  • 5/3D Heterogeneous Packaging
  • Hermetic and Plastic Packaging
  • Wafer Bumping
  • Component Modification

Test

  • Up-Screening
  • Electrical Testing
  • Environmental Testing
  • Reliability Testing
  • Counterfeit Mitigation
  • Component Inspection
  • Wafer Probe

Component Modification

Micross CMS provides an unparalleled array of hi-rel microelectronic product, packaging, test & qualification capabilities servicing the space, defense, aerospace, medical, communications, and other hi-rel markets.

 

Turnkey & SMI available, S20.20 Certified.

 

Component Solutions

  • BGA Reballing
  • Robotic Hot Solder Dip (RHSD)
  • Lead Attach
  • CGA Attach
  • Trim/Form and Reconditioning

PCB Solutions

  • Assembly
  • Rework
  • Repair
  • Component Harvesting

Support Solutions

  • Tape and Reel
  • 3D Scanning
  • Bake and Package
  • Marking, Labeling and Kitting

Supply Chain Services

Semiconductor technology moves so fast that many devices reach their end of life (EOL) within a few years due to Diminishing Manufacturing Sources (DMS) or Diminishing Manufacturing Sources and Material Shortages (DMSMS), either because demand is falling or they have been replaced by improved devices with additional features and specifications. However, the new devices often are not pin-to-pin, spec-to-spec replacements for the EOL legacy devices, which makes it difficult for OEMs to continue to build and support legacy military and space products that rely on the EOL device.

 

Based on our extensive experience with this all-too-common scenario, we’ve developed an in-depth understanding of how to manage semiconductor obsolescence and mitigate the risks associated with EOL devices. Our design engineers will consult with you to determine which of our services best meets your needs.

 

Counterfeit Mitigation

EOL/DMSMS Sustainment

Original Qualified Product

Form-Fit-Recreation

Program Sustainment Management

Proactive Solutions

  • EOL Die Sustainment Program (EDSP)
  • Access to Broadest Supply of Die & Wafer
  • BOM Monitoring
  • Long Term Die, Wafer & Component Storage
  • Supplier Managed Inventory

Reactive Solutions

  • Product Reconditioning (Original Qualified Product)
  • Product Recreation (FFF Equivalent)
  • Equivalent Die Characterization & Sourcing
  • Up-Screening to Industrial, Military or Space Grade
  • Component Harvesting

Counterfeit Mitigation

  • Reactive Solutions

Advanced Packaging

Advanced Packaging

  • 5 & 3D Heterogeneous Integration
  • Chiplet Integration
  • Wafer Bumping & WLP
  • Multi-Chip Modules (MCMs)
  • Novel Microfabrication & MEMS

 

Design, Packaging and Assembly

  • Assembly Services
  • Final Test
  • Chip on Board (CoB)
  • Plastic Packaging (BGA/CSP/QFN)
  • Hermetic Packaging

Wafer Processing

Micross is the largest worldwide value-added bare die processor and distributor with a comprehensive array of capabilities to fully process wafers; from wafer saw to wafer bumping for your entire bill of materials. Whether a commercial product or your own die design, we will process wafer product to your exact specifications and choice of end supply form.

 

Over the years, Micross has developed and maintained key relationships with many of the leading semiconductor manufacturers providing us with the capability to offer an extensive bare die portfolio to our customers.

 

  • Wafer Thinning & Dicing
  • Die Plating / Customized Output
  • Visual Inspection
  • Lot Acceptance Testing
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