Kaohsiung, Taiwan – August 13, 2025 — ASE Group (Advanced Semiconductor Engineering), the world’s leading OSAT (Outsourced Semiconductor Assembly and Test) provider, has taken a bold step forward in meeting skyrocketing demand for advanced packaging by acquiring a facility from GaAs foundry WIN Semiconductors. The purchase, approved by the board of its subsidiary ASE Semiconductor, involves a plant and related infrastructure located in the Southern Taiwan Science Park in Kaohsiung, valued at NT$6.5 billion.
This strategic acquisition comes amid a dramatic surge in demand for high-end packaging, especially for applications in artificial intelligence (AI) and high-performance computing (HPC). Analysts and insiders see ASE’s move as a clear vote of confidence in the long-term trajectory of advanced assembly and testing demand.
This transaction adds significant capacity to ASE’s Kaohsiung footprint—complementing earlier investment in new technologies. Notably, ASE is putting US$200 million toward its inaugural 600 mm Fan-Out Panel Level Packaging (FOPLP) production line, which is slated for equipment installation in Q2–Q3 2025, with trial production by year-end.
