 
						SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced it raised $65.4 million in a Series D round led by existing investors Sutter Hill Ventures, Chengwei Capital, Spark Capital, Osage University Partners and Huami, alongside new investor Qualcomm Ventures LLC. This Series D round
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						IC Insights will release its June Update to the 2019 McClean Report later this month. This Update includes a 2017-2023 IC database that segments the actual 2017 and 2018 and forecasted 2019-2023 IC market by major product type by Consumer, Auto, Computer, Industrial, Communications, and Government/Military end-use applications in the Americas, Europe, Japan, and Asia-Pacific
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						Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Cypress Semiconductor Corporation (NASDAQ: CY) today announced that the companies have signed a definitive agreement under which Infineon will acquire Cypress for US$23.85 per share in cash, corresponding to an enterprise value of €9.0 billion.
 
Reinhard Ploss, CEO of Infineon, 
 
						BrainChip Holdings Ltd (ASX: BRN), the leading AI EDGE company, today announced the availability of the Company’s Akida Neural Processing Core (“NPC”) as intellectual property available for licensing. This introduction marks a major development in the Company’s market presence.
The Akida NPC is now available to license as an
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						San Jose, California – May 29, 2019. Mixel® Inc., a leader in mixed-signal intellectual property (IP), and Teledyne Imaging, a leader in sensor, signal generation, and image processing, today announced that Mixel MIPI® IP has been successfully integrated into Teledyne e2v Snappy 2-Megapixel and 5-Megapixel CMOS Image Sensor IC products.
 
The 
 
						Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that its technology to protect wireless antenna pads is now published as a patent by the European Patent Office. The clipping/scaling circuit is used to protect the Near Field Communication (NFC) antenna pads in an ultra-low power Bluetooth chip
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