Author Archives: anysilicon

Name: anysilicon

CoreHW releases IP library with over 200 IP

Old CPU chips and obsolete computer processors

CoreHW releases an IP library with over 200 silicon verified IP. Silicon proven solutions allow fast end-product development and implementation. The IP library gives a comprehensive look to company’s IP range and makes it easier and faster for customers to start their ASIC design process.
 
The IP listed in

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How Best-In-Class Companies Reduce ASIC Power Consumption

cpu or central processor unit

Power, performance and area (PPA) are three core competencies on which an ASIC design is evaluated. In an ideal world, ASIC designers strive to improve the performance of their design in a minimum possible silicon area with lowest possible power dissipation. However, there exists a trade-off between these three key

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Semiconductor lithography equipment market: how megatrends are going to change the future

The man with a carrier of the silicone wafers

The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the MtM industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big

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Sankalp wins STPI Highest Exporter Award – ITES

Bangalore, India – Nov 30, 2018 – Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, received the Software Technology Parks of India (STPI) award for being the Highest Exporter – ITES in the Hubli Region. Sankalp Semiconductor has consecutively fourth time won

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Samsung’s Big Semi Capex Spending Keeps Pressure on Competition

Investment budget local government

IC Insights revised its outlook for total semiconductor industry capital spending and presented its forecast of semiconductor capex spending for individual companies in its November Update to The McClean Report 2018, which was released earlier this month.
 
Samsung is expected to have the largest capex budget of any IC supplier again in

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MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC

Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC.
 

 
HPC is highly intensive in terms of CPU activity and requires ever increasing levels of

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