Author Archives: anysilicon

Name: anysilicon

Why The Time is Right for Open Source Hardware and ‘Chips as a Service’

Direction Uncertainty

The open source software movement has been credited as a key driver of the birth of the Internet Age. Without developments such as Linux; the free Apache Web-server platform; and tools such as Java, Perl and Ruby, the Web as we know it would likely not have been possible.
 
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Cambricon employs Moortec’s embedded PVT Monitoring Subsystem IP to their Artificial Intelligence (AI) and Machine Learning Chips

Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Cambricon have used Moortec’s 16FFC In-Chip Monitoring Subsystem IP in their artificial intelligence (AI) and machine learning chips.
 
“After a comprehensive investigation on almost all commercial solutions, we concluded that the PVT sensors from Moortec were the best

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Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 7FF

Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process.
 
Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to

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Sondrel Announces £10M Investment in European Semiconductor Sector

Sondrel today announced its target to hire 100 electronic engineers in Europe, amounting to an investment of ten million pounds into the semiconductor sector over the next 3 years.
 
This comes swiftly on the heels of the acquisition of the IMGWorks team from Imagination Technologies; a move that increased the engineering headcount

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Wire-Bond Chip Array BGA — A New Near Die Size Packaging Innovation

Abstract
Expanding its ChipArray® Ball Grid Array (CABGA) package form factor miniaturization efforts, Amkor now offers a maximum 0.40 mm height CABGA assembly process. Amkor’s latest CABGA process has been extensively demonstrated, evaluated and optimized to provide reliable, high-quality production. By extending CABGA capabilities to various competing near die size

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Sankalp Semiconductor awarded with ISO 9001: 2015 certification

wafer

Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, today announced its upgradation to ISO 9001:2015 certification. By meeting the extensive criteria for the ISO 9001: 2015 standards, the company reinforces its ability to deliver IC design services with continuous improvements in its offerings and

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