Prior to 2008, the 200mm silicon wafer was used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm silicon wafers. Rankings of silicon manufacturers by installed capacity for each of the wafer sizes are shown
Read MoreAccording to Business Korea Samsung Electronics is considering a reorganization of the System LSI division in order to systematically grow the system semiconductor business. The company is planning to separate the design and manufacturing sectors in the business unit and divide or spin off it to fabless and foundry business
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SANTA CLARA, DECEMBER 15th 2016 – ELSYS America celebrates its 1st anniversary in the Silicon Valley. ELSYS America is built upon its mother company’s, ELSYS Design, 15+ years experience in integrated circuit design, partnering with all the major semiconductors companies based in Europe; it has successfully extended this offer to
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MOUNTAIN VIEW, Calif., Dec. 12, 2016 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Maria Marced, President of TSMC Europe BV., has been appointed to its board of directors, as an independent non-executive director, effective December 8, 2016.
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It can be asked why design a dual port memory bit? Is this not a case of re-inventing the wheel? Not necessarily. Most memories are designed with speed being the main design goal. You achieve speed by limiting that range of voltages and temperatures that the memory will operate over.
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Vigorous M&A activity in 2015 and 2016 has reshaped the landscape of the semiconductor industry, with the top companies now controlling a much greater percentage of marketshare. Not including foundries, IC Insights forecasts to top five semiconductor suppliers—Intel, Samsung, Qualcomm, Broadcom, and SK Hynix— will account for 41% marketshare in
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