Author Archives: anysilicon

Ridgetop Group and BaySand Partner to Expand Mixed-Signal IP Portfolio

Ridgetop Group, Inc. and Silicon Valley-based BaySand Inc., the leader in application configurable application specific integrated circuits (ASICs), today announced they will work cooperatively to develop a series of new applications to increase their existing mixed-signal intellectual property core (IP) portfolios.
 
Through a wide-ranging partnership, they also will offer

GLOBALFOUNDRIES Unveils 12nm FD-SOI Process Node

GLOBALFOUNDRIES today announced a new 12nm FD-SOI semiconductor technology mode, extending its leadership position by offering the industry’s first multi-node FD-SOI roadmap. Building on the success of its 22FDXTM offering, the company’s next-generation 12FDXTM platform is designed to enable the intelligent systems of tomorrow across a range of applications, from mobile

IoT Semiconductor Market will reach $29.6B in 2019

Global growth in the number of “things” connected to the Internet continues to significantly outpace the addition of human users to the World Wide Web.  New connections to the “Internet of Things” are now increasing by more than 6x the number of people being added to the “Internet of Humans”

Investment: Wafer Level Packaging Company Receives $51.5M Investment

Deca Technologies, a wafer level packaging provider to the semiconductor industry, announced today the receipt of an additional $51.5 million investment from a leading electronics company. Combined with the previously announced investment from ASE of $60 million, and following the repurchase of $20.6 million of shares held by Cypress Semiconductor Corp.,

Semiconductor Foundries Sales Growth 2014-2016

IC Insights released its August Update to the 2016 McClean Report earlier this month.  This Update included an update of the semiconductor industry capital spending forecast, a look at the top-25 semiconductor suppliers for1H16, including a forecast for the full year ranking, and Part 1 of

Sidense Demonstrates Successful 1T-OTP IP Core Operation in TSMC 16nm FinFET Process

Sidense Corp., a leading developer of Non-Volatile Memory (NVM) One-Time Programmable (OTP) IP cores, today announced that it has demonstrated successful operation of its patented SHF 1T-OTP memory IP macros at TSMC’s 16FF+ and 16FFC process nodes.

Parametric measurements for both 16FF+ and 16FFC silicon were made during programming