February-7, 2025 — TSMC , Taiwan’s leading semiconductor manufacturer, is reportedly planning a new 1-nanometer fabrication plant in Tainan’s Shalun area. This massive facility, a Giga-Fab capable of housing six 12-inch wafer fabs, aims to leverage the existing advanced manufacturing cluster in the Southern Taiwan Science Park (STSP). Its location
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February 6, 2025 — GlobalFoundries (GF), a leading semiconductor manufacturer, announced a significant leadership transition and outlined ambitious expansion plans this week. Effective April 28th, 2025, Tim Breen, currently the Chief Operating Officer (COO), will succeed Thomas Caulfield as President and CEO. Caulfield, who has served as CEO since 2018,
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The semiconductor industry is experiencing a surge in investment and expansion of advanced packaging facilities, driven by increasing demand for high-performance computing and other applications. Several key players are significantly expanding their capacity, aiming for substantial production increases by 2025. This expansion is geographically diverse, with major projects underway in
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NORTH READING, Mass.–(February 3, 2025 )– Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test solutions, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, today announced they have entered into a strategic partnership to advance power semiconductor test.
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Mannheim, Germany, January 30, 2025 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process
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Munich, Germany, and Oxford, UK – 28th January, 2025 — Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.
Under the MoU, RED will leverage the Codasip Studio processor design tools to integrate its VISC technology as an accelerator for Codasip