LONDON & TORONTO, Sept. 24, 2025 –
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tapeout of the industry’s leading 64 Gbps UCIe™ die-to-die (D2D) IP subsystem on TSMC’s 3nm process technology. Building on its 36
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Sept. 24, 2025 – CAMPBELL, Calif. – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation, today announced that NanoXplore, a French provider of radiation-hardened system-on-chip (SoC) FPGA technology, has licensed Arteris’ FlexGen smart NoC IP for its space designs. FlexGen will be used in the development
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Sept. 23, 2025 –
EnSilica and Codasip announce strategic partnership to bring CHERI cybersecurity to automotive, critical national infrastructure, defence and aerospace applications
Oxfordshire, United Kingdom and Munich, Germany – EnSilica, a fabless supplier of mixed-signal and digital ASICs, and Codasip, a provider of functionally-safe and cyber-resilient RISC-V CPUs, announces
Lawrenceville, GA , Sept. 18, 2025 – Silicon Creations, a leading provider of precision IP for advanced SoC design, today announced its 1000th production FinFET tapeout at TSMC, alongside the immediate availability of a comprehensive library of IP on TSMC’s advanced N2P process node. The N2P offering includes a full suite of PLLs and clocking IP, such as free-running
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In an unexpected twist in the semiconductor world, two longtime rivals—Nvidia and Intel—have struck a deal that some are calling historic. On September 18, 2025, Nvidia announced it would invest $5 billion in Intel, buying common stock at $23.28 per share and acquiring roughly a 4–5% stake in the company.
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HYDERABAD, India, Sept. 16, 2025 — Cyient Semiconductors, a leader in custom ASIC/ASSP and intelligent power solutions, announced a strategic partnership with Anora, a global provider of semiconductor test, testability, and validation services. The collaboration brings together complementary strengths to provide comprehensive, end-to-end solutions for semiconductor product development.
Under this