Innovative medical devices, autonomous vehicles, IoT applications, cloud based organizations, 5G communication networks and more high-end industries are basing their products on microelectronics and micro-optical components.
Constant reduction in chip size and uncompromising placement accuracy demands are some of the dominant challenges those industries are facing.
We, in Beckermus Technologies, aiming to keep serving our clients with the best-of-breed micro-assembly solutions, prepared ourselves for the challenge by building an Active Alignment department.
The most recent addition to Beckermus’ facilities is a ficontec CL1500 machine. The machine’s built-in advanced capabilities were extended to accommodate our needs as a service company.
The CL1500 was adjusted to easily apply to multiple types of micro assembly requirements. This way we are able to instantaneously move from building the very first prototype to one company to a high volume production of a completely different product to another firm.
Beckermus active alignment key capabilities selected to ensure diversity and multiple applications
Passive/active high-precision alignment
High-precision bonding accuracy
Chip-on-Submount (CoS)
Lens assembly into packages
Pick-&-Place & handling sub-systems
Die sorting and component tracking
High accuracy epoxy bonding
UV Curing
Electronically adjustable bond force in mg range
Process parameter sequencing & tracking
Acquisition of operating parameters into a database
OCR for serial number tracking and component traceability
