Category Archives: Wafer and Foundries

TSMC Q3 2024 Earnings: Strong Results Driven by AI Demand, but Challenges Remain

TSMC

October 17, 2024 – Taiwan Semiconductor Manufacturing Company (TSMC) today reported strong third-quarter 2024 earnings, exceeding guidance and fueled by robust demand for high-performance computing (HPC) chips, particularly in the artificial intelligence (AI) sector. However, the company also highlighted challenges related to inventory levels, rising costs, and the ramp-up of

Read More

TSMC Invests US$116 Million in Vanguard International Semiconductor, Expanding Global Semiconductor Footprint

press release chip

Hsinchu, Taiwan [9-Oct-2024] – Taiwan Semiconductor Manufacturing Company (TSMC) (TWSE: 2330, NYSE: TSM) today announced a significant investment in Vanguard International Semiconductor Corporation (VIS), further solidifying its position in the global semiconductor industry. TSMC has acquired 42,485,831 shares of VIS at NT$88 per share, representing a total investment of approximately

Read More

Samsung Foundry Accelerates 2nm Production, Faces Challenges in Advanced Node Deployment

press release wafer fab

Samsung Foundry is accelerating its efforts to establish mass production capabilities for its 2nm process technology, according to industry sources. The company is actively equipping its “S3” foundry line at the Hwaseong plant, aiming for a monthly capacity of 7,000 wafers by Q1 2024. Further expansion is planned with the

Read More

Powerchip Semiconductor (PSMC) Shifts Focus from Japan to India for New $10.9 Billion Fab

india flag wafer

Taipei, Taiwan – October 2, 2024 – Powerchip Semiconductor Manufacturing Corporation (PSMC), a leading Taiwanese foundry, has announced a strategic shift in its global expansion plans, opting to scrap a previously announced semiconductor fab project in Japan in favor of building a new fab in Gujarat, India. The decision comes

Read More

Toppan Photomask Rebrands as Tekscend Photomask, Signaling a New Era of Technological Advancement

wafer

Tokyo, Japan – October 2, 2024 – Toppan Photomask, a global leader in the semiconductor photomask industry, will officially change its name to Tekscend Photomask on November 1, 2024. The rebranding represents a strategic move to reflect the company’s ongoing commitment to technological innovation and growth as a premier photomask

Read More

European Commission Approves €1.9 billion for Intel Chip Plant in Poland

intel logo

The European Commission has approved Poland’s plan to provide over 7.4 billion zlotys ($1.91 billion) in state aid to support Intel’s construction of a new semiconductor assembly and test facility near Wroclaw. This green light marks a significant step forward in the project, which is expected to be finalized by

Read More
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.