Category Archives: ASIC Industry Market Trends

Top 15 Semiconductor Sales Leaders – 2019

November 18, 2019, anysilicon

IC Insights’ November Update to the 2019 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2019 (the top-15 2019 semiconductor suppliers are covered in this research bulletin).  The Update also includes a detailed five-year forecast of the IC market by product type (including dollar volume, unit shipments, and

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eSilicon to be Acquired by Inphi and Synopsys

November 11, 2019, anysilicon

SAN JOSE, Calif. — November 11, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of a definitive agreement with Inphi Corporation (NYSE: IPHI) to acquire eSilicon.  Concurrently, Synopsys, Inc. (Nasdaq: SNPS) announced the signing of a definitive agreement

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Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019

November 05, 2019, anysilicon

IC Insights’ November Update to The McClean Report 2019 will include a capital spending forecast for the major semiconductor companies for 2019 and 2020.  In January of next year, IC Insights will release The McClean Report 2020 and present its seminars that review the five-year forecasts for the IC industry.
The share of semiconductor industry capital

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HDL Design House Appoints Frank Werner as Worldwide Sales Director

October 01, 2019, anysilicon

Belgrade, Serbia – October 1st, 2019 – HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs,  announced the appointment of Frank Werner as Worldwide Sales Director, effective immediately. With more than 25 years of experience in different

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Memory Forecast to Account for 43% of Total 2019 Semi Spending

September 12, 2019, anysilicon

Capex spending for memory ICs was the driving factor behind very strong increases in industry-wide capex spending over the past two years.  Most of those upgrades and expansion plans are now completed or have entered their final building phases.  As a result, memory capex is forecast to account for 43%

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HDL Design House Introduces Expandable SoC IoT Platform

August 22, 2019, anysilicon

Belgrade, Serbia – August 22nd, 2019 – HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs, today announced the launch of its easily expandable, reusable and flexible SoC IoT Platform using the Arm® Corstone™ foundation IP package. The solution

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