Category Archives: ASIC Industry Market Trends

Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicle. This participation in the alliance underscores

High Bandwidth Memory (HBM): Ultimate Guide

HBM presents a significant leap over traditional memory types. Key features such as astonishing memory bandwidth, reduced power consumption, impressive memory capacity, and swift transfer rates distinguish HBM from its predecessors. Understanding these characteristics is essential for appreciating the impact of this cutting-edge technology.
 

 
Embark on a

Crucial role for imec in EU Chips Act – NanoIC pilot line set to receive investment of €2.5B

LEUVEN (Belgium), MAY 21, 2024 — This week, at its technology forum ITF World 2024, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, announces it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth,

Introduction to eDRAM

eDRAM Overview
 
A key factor in improving memory operations in System on Chips (SoC) is the use of embedded dynamic random-access memory (eDRAM), which means that the DRAM memory is inside the chip. This helps with enhancing the effectiveness and functionality of electronic products by reducing power consumption and

CEO Talk: Michael Dube, EVP at Rochester Electronics

This interview was held with Michael Dube, Executive Vice President of Manufacturing Operations and Engineering of Rochester Electronics.
 

 
Tell me a bit about your background? How did you first get started with Rochester Electronics?
 
Sure, let me share a bit about my journey. I kicked off my

HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

LAS VEGAS—January 8, 2024—Today, HaiLa Technologies Inc., a fabless semiconductor and software company focusing on hyper power-efficient wireless communications system-on-chip solutions for IoT devices, announces availability of the BSC2000 RF Evaluation Chip Development and Demonstration Kits. Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design, engineering, and