November 18, 2019, anysilicon
IC Insights’ November Update to the 2019 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2019 (the top-15 2019 semiconductor suppliers are covered in this research bulletin). The Update also includes a detailed five-year forecast of the IC market by product type (including dollar volume, unit shipments, and
Read MoreNovember 11, 2019, anysilicon
SAN JOSE, Calif. — November 11, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of a definitive agreement with Inphi Corporation (NYSE: IPHI) to acquire eSilicon. Concurrently, Synopsys, Inc. (Nasdaq: SNPS) announced the signing of a definitive agreement
Read MoreNovember 05, 2019, anysilicon
IC Insights’ November Update to The McClean Report 2019 will include a capital spending forecast for the major semiconductor companies for 2019 and 2020. In January of next year, IC Insights will release The McClean Report 2020 and present its seminars that review the five-year forecasts for the IC industry.
The share of semiconductor industry capital
October 01, 2019, anysilicon
Belgrade, Serbia – October 1st, 2019 – HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs, announced the appointment of Frank Werner as Worldwide Sales Director, effective immediately. With more than 25 years of experience in different
Read MoreSeptember 12, 2019, anysilicon
Capex spending for memory ICs was the driving factor behind very strong increases in industry-wide capex spending over the past two years. Most of those upgrades and expansion plans are now completed or have entered their final building phases. As a result, memory capex is forecast to account for 43%
Read MoreAugust 22, 2019, anysilicon
Belgrade, Serbia – August 22nd, 2019 – HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs, today announced the launch of its easily expandable, reusable and flexible SoC IoT Platform using the Arm® Corstone™ foundation IP package. The solution
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