Category Archives: ASIC Industry Market Trends

GLOBALFOUNDRIES Downsizing in Germany

GlobalFoundries is downsizing at its semiconductor plant in Germany by 20 percent, according to several newspapers in Germany.
 
GlobalFoundries has factories in Germany, Singapore and the USA. The “Fab 1” in Dresden is one of the largest private employer in the city. The plant is equipped with a clean room

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Flip Chip Technology & Market Trends

Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12”eq.wafers) in 2020, supported by the wider adoption of Cu pillar technology. That growth will be led by Moore’s law pushing beyond the 28nm node and ‘More than Moore’ evolution in next generation

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Financial Obstacles Delaying 450mm Wafers Development

According to the latest report released by IC Insights, Global Wafer Capacity 2015-2019 shows a delay in 450mm wafers’ development and production in contrast to an increased 300mm wafers’ consumption by technology companies.
 
Judging from statistics, in fact, despite the huge economic incentives that would be generated on the

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Fabless-Foundry model vs. Integrated Device Manufacturers Model

I authored my first book “Mass Capitalism : A Blueprint for Economic Revival” in 2014 with a purpose of letting the global semiconductor industry ( and particularly the US Semiconductor Industry) know that the Semiconductor Industry is headed for a monumental transformation in the very near future due to a

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IBM, GlobalFoundries Deal to To Close July 1st

The tech world was buzzing during last October when IBM agreed to pay GlobalFoundries $1.5 billion to take over their semiconductor manufacturing facilities in East Fishkill and Vermont. The deal is now expected to close as of July 1st.
 
The closing of the deal will put to end months

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GLOBALFOUNDRIES Release Schedule for 14nm

The 14nm technology development between Samsung and GlobalFoundries that started last year is now reaching its final step by releasing the availability schedule of the process technology including the 2 main flavors.
 

 
The primary concept of the strategic collaboration is to make 14nm FinFET technology available at

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