IP Cores

[Giovani]

I know it sounds a bit crazy but we are using today a wafer scale package, is there any way to get the package size smaller than WLCSP?

Thank you in advance,
Giovani.

[Yovav]

Hi Giovani,

You cannot get a package smaller than the die size.
The smallest you can get is WLCSP, meaning, having the die with bumps on it, and no molding.

Yovav.