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Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully completed silicon validation of its High Bandwidth Memory (HBM2) IP subsystem in TSMC’s 16nm FinFET technology in combination with TSMC’s CoWoS® 2.5D silicon interposer technology and HBM2 memory. This full IP subsystem solution includes an HBM2 controller, PHY and
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eASIC® Corporation (@easic), a fabless semiconductor company that delivers custom integrated circuit platform solutions (eASIC Platform), today announced that it has appointed Si-Edge Technology (Si-Edge) as an advanced design center located in Hong Kong and Shenzhen, China.
The eASIC Platform has been deployed in a wide range of applications spanning wired
As this happens, designers are debating how they can approach designs in such a way that they’re not relying on packing yet-more transistors onto a chip to achieve speed increases. One of the biggest innovations in this industry is going to come from a fundamental reapplication of a technology that
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The historic flood of merger and acquisition agreements that swept through the semiconductor industry in the past two years slowed to a trickle in the first half of 2017, with the combined value of about a dozen transactions announced in 1H17 reaching just $1.4 billion.
In the first halves of 2016
Vidatronic, Inc. today announced the appointment of Avant Technology as the distributor of its proprietary power management Intellectual Property (IP) cores, products, and design services in Asian marketplaces, including representation in China, Taiwan, Korea, Japan, Malaysia, Vietnam and Singapore.
“With Avant as our distributor, we increase our presence in a
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its turnkey FPGA to ASIC conversion service. This service was introduced to meet increasing demand from customers who require a lower BOM cost, lower power consumption, higher integration for miniaturization, and long-term supply commitments, and
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The open source software movement has been credited as a key driver of the birth of the Internet Age. Without developments such as Linux; the free Apache Web-server platform; and tools such as Java, Perl and Ruby, the Web as we know it would likely not have been possible.
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Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Cambricon have used Moortec’s 16FFC In-Chip Monitoring Subsystem IP in their artificial intelligence (AI) and machine learning chips.
“After a comprehensive investigation on almost all commercial solutions, we concluded that the PVT sensors from Moortec were the best
Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process.
Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to
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Expanding its ChipArray® Ball Grid Array (CABGA) package form factor miniaturization efforts, Amkor now offers a maximum 0.40 mm height CABGA assembly process. Amkor’s latest CABGA process has been extensively demonstrated, evaluated and optimized to provide reliable, high-quality production. By extending CABGA capabilities to various competing near die size