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The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry. “IoT driven semiconductor industry consolidation, is reflecting into a highly dynamic advanced packaging landscape”, comments Andrej Ivankovic, Technology &
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IC Insights has released its Global Wafer Capacity 2016-2020 report that provides in-depth detail and analysis of foundry ranking capacity by wafer size, by process geometry, by region, and by product type. The new report provides a ranking of the industry’s 25 largest IC manufacturers and foundries in terms of installed
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For the packaging industry, the smartphone changed everything, and experts agree that more changes— potentially big ones—are underway.
Bill Chen, a senior fellow at ASE Group, said when personal computers ruled chip demand, the main components had fairly standard package formats. The pace of change has picked up in
The 3C’s of verification i.e. Constraints, Checkers & Coverage have been playing an important role enabling faster verification closure. With growing complexity and shrinking market windows it is important to introduce the 4th C that can be a game changer in actually differentiating your product development life cycle. Interestingly the 4th C
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Optimal+, a leader in Manufacturing Intelligence solutions, today announced that it was selected by Freescale® Semiconductor to deliver their enterprise software suite to enhance the efficiency of their global manufacturing operations. In a move intended to improve the utilization of Freescale’s manufacturing equipment worldwide, the two companies signed a multi-year
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[Press Release] AnySilicon, the fastest-growing semiconductor marketplace has announced today the availability of a free semiconductor hotline service offering expert-level answers to technical and commercial ASIC questions. Using this free service companies can better meet schedule and budget objectives and avoid wrong decisions due to lack of information.
The hotline
Over many years and based upon Moore’s Law, transistor counts have doubled approximately every 24 months as features increase and semiconductor dies grow. This has led to performance increases of 1000x over 20 years with microarchitecture advances and faster transistors.
With the technology, developers obtained
For decades, EDA industry has been working out options to improve their offerings and ensure silicon success for the semiconductor industry. A few decades back, while the EDA giants were unknown, design automation was exercised individually in every organization developing a product. Gradually these tools moved out of the design
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The Chinese investment company, Tsinghua Unigroup Ltd, plans to invest $ 47 billion in the next five years to become the world largest chipmaker.
In an interview, Chairman Zhao Weiguo hinted Reuters that the next few weeks there could be a purchase deal for a big chip maker in
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of Flip Chip technology for LED and CMOS Image Sensors (CIS) applications, the Flip Chip market is expending. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and
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