Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
IC Insights will release its November Update to the 2015 McClean Report later this month, and its new 2016 edition of The McClean Report in January. The November Update will include the latest IC market forecasts by product type through 2019, a detailed forecast for semiconductor industry capital spending by company for 2016, and a ranking of
Read More
Google is taking the next necessary steps towards the mobile phone market and plans to start developing and producing CPU chips for enabling a complete mobile phone eco system, to be combined with its successful Android operating systems.
Google has started in recent weeks talks with several processors
Read More
As technology evolves, more functionality is being added on SOCs. At same time, pressure is building up to reduce operating and standby power. Today the market is focused on reducing power in wide spectrum of SOCs from CPUs, GPUs and Mobile not just IOT/wearable SOCs. Battery powered SOCs require
Read More
In past few months, while interacting with customers, I came across a couple of cases where the VIP played a spoilsport. In one case, the IP & VIP were procured from the same vendor during the early phase of standard protocol evolution. One of the key USPs of the product was
Read More
“The fact that TSMC is interested in advanced packaging isn’t “new news”, comments Jean-Christophe Eloy, President & CEO, Yole Développement (Yole). He adds: “Over the last few years TSMC has significantly invested in flip-chip copper pillar capacities (Source: 2015 Flip Chip Business Update report, October 2015) and 3DIC stacking for
Read More
While the entire semiconductor industry is excited about FinFET and FDSOI process technologies, there is one semiconductor technology that considered by engineers as “the process for real men” and it’s called BiCMOS.
BiCMOS process is essentially a combination of Bipolar transistor and CMOS transistors, it offers many technical advantages
Sony has announced that its semiconductor unit will now be separated from the company’s core business. The strategic decision arrived in order to allow the Japanese electronic firm to focus its resources and attentions on the Devices and the Digital image divisions. This last one in particular, in fact, has
Read More
Interesting and surprising cooperation: Intel is developing the modem chip to be used in the next iPhone’s devices. To meet Apple’s tough and tight schedule IBM has allocated a staff of about 1,000 people. Intel’s foothold in what is expected to be the world’s best-selling smartphone has a dramatic importance
Read More
According to the latest reports, Temasek and China’s Jiangsu Changjiang Electronics Technology Co Ltd (JCET) just signed a $1.8 million deal that will allow JCET to acquire STATS ChipPAC from Temasek.
The decision followed the new internal financial policy at Temsasek which aims to diversify the
PMC-Sierra, a provider of data center chips, will soon be part of the radio components manufacturer Skyworks after signing a $2billion purchase agreement.
Notwithstanding the fact that this deal might sound strange to many, the decision occurred as a simple product expansion and a chance to widen the buying