Semiconductor Latest News

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Digital Blocks extends leadership of UDP/IP networking with 50 & 100 GbE

News

GLEN ROCK, New Jersey, December 30, 2019 – Digital Blocks, a leading developer of silicon-proven semiconductor Intellectually Property (IP) soft cores for system-on-chip (SoC) ASIC, ASSP, & FPGA developers with Embedded Processor & Peripherals requirements, extends its leadership of low-latency, high performance UDP/IP networking Verilog Cores with releases for 50 &

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FIB Circuit Edit

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What is a Circuit Edit?
 
A circuit edit is when you need to modify an existing ASIC or integrated circuit for whatever reason. This is usually done with the help of an ion beam that is focused onto the chip to modify it as per the request of the

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Record Amount of IC Capacity Forecast to be Added in 2021

IC Insights recently released its Global Wafer Capacity 2020-2024 report that provides in-depth analyses and forecasts of IC industry capacity by wafer size, by process geometry, by region, and by product type through 2024.
 
Typically, the IC industry meets most of its IC unit demand by increasing wafer starts, not by

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Faraday Unveils New IoT SoC Platform to Accelerate Early-Stage ASIC Development

News

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced the Faraday FIE3240 FPGA platform, the latest addition to its SoCreative!™ IoT SoC platform series. The reprogrammable FIE3240 platform offers enhanced flexibility and scalability for today’s AIoT SoC designs utilizing Arm® Cortex®-M series processors.
 
In

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eMemory Joins Arm Ecosystem for Secure IoT Chips

text labeled PRESS RELEASE

Hsinchu, Taiwan (December 19, 2019) – eMemory Technology, one of the world’s top-ten providers of semiconductor intellectual property (IP), is working with Arm to create new state-of-the-art secure solutions for Internet of Things (IoT) chips.
 
eMemory will provide its proprietary NeoFuse IP to be implemented into the Arm® CryptoIsland™-300P

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Intel Acquires Artificial Intelligence Chipmaker Habana Labs

acquisition

SANTA CLARA, Calif.–(BUSINESS WIRE)–Intel Corporation today announced that it has acquired Habana Labs, an Israel-based developer of programmable deep learning accelerators for the data center for approximately $2 billion. The combination strengthens Intel’s artificial intelligence (AI) portfolio and accelerates its efforts in the nascent, fast-growing AI silicon market, which

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Enabling security in embedded system using M.2 SSD

Direction uncertainty with a landscape

Storage technologies are evolving at a high speed, thanks to new generations of memories such as Nandflash, ReRAM, MRAM and other flavors. That leads in an incredible performance increase in term of bandwidth and latency. By the way, security and data privacy features are still an important feature for critical

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NAND Flash to Lead All Others As IC Market Growth Returns in 2020

IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2020, which will be released in January 2020.  Among the revisions is a complete update of forecast growth rates of the 33 main product

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IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices

News

Meylan, FRANCE – December 05, 2019 – IC’Alps, French expert in design and supply of custom integrated circuits, announced today that it has been granted the prized ISO 13485:2016 certification for its Quality Management System (QMS).
 
ISO 13485:2016 is an international quality standard required by the medical device industry,

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Vehicle autonomy & electrification are pushing the adoption of advanced packaging

car

“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).
 
Two automotive megatrends, autonomy and electrification are today pushing the development of multiple devices with dedicated packaging. Without doubts, the automotive

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