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Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, <28nm capacity is forecast to represent about 49% of the IC industry’s total capacity, based on information in IC Insights’ Global Wafer Capacity 2019-2023 report. At the very leading
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Santa Clara, Calif. and Dresden, Germany, Oct. 10, 2019 — A major limiting factor in the growth of Internet of Things (IoT) applications is the amount of power consumed by the edge devices used in IoT networks, and as a result, there is an urgent need to find ways to use
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Meylan, FRANCE – OCTOBER 08, 2019 – IC’Alps, the French one-stop shop ASIC partner offering custom Integrated Circuit development and supply, today announced it has been appointed an Arm® Approved Design Partner.
The Arm Approved Design Partner program is a global network of design service companies endorsed by Arm.
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London, United Kingdom – October 7, 2019 – Dialog Semiconductor plc, a leading provider of power management, charging, AC/DC power conversion, Wi-Fi and Bluetooth® low energy technology, today announced it has signed a definitive agreement to acquire Creative Chips GmbH, a prominent supplier of Integrated Circuits (ICs) to the Industrial
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Hsinchu, Taiwan R.O.C., Oct 1, 2019 – TSMC, the world’s leading global innovator in semiconductor manufacturing, filed multiple lawsuits on September 30, 2019 against GlobalFoundries in the United States, Germany and Singapore for its ongoing infringement of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node
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Belgrade, Serbia – October 1st, 2019 – HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs, announced the appointment of Frank Werner as Worldwide Sales Director, effective immediately. With more than 25 years of experience in different
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Lead Frame Overview
A lead frame is a generic term for a type of (mostly) low-cost IC package assembly used for DIL types packages as well as PLCCs and QFNs.
The frame is typically made of a thin layer of copper, though other materials, such as aluminum
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Belgium, September 26, 2019 – Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that it has expanded its TakeCharge® Electrostatic Discharge (ESD) and Analog I/O portfolio with solutions for TSMC’s N5 process technology. The cells enable high speed and high frequency interfaces.
Today many communication channels,
Taiwan Semiconductor Manufacturing Company’s heavy investments in advanced wafer-fab technology are set to pay off significantly for the world’s largest silicon foundry as it continues the production ramp of 7nm ICs in the second half of this year, according to an analysis in IC Insights’ September Update to the 2019 McClean Report.
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Neuchatel, 24 September 2019 – CSEM, a leader in low-power RFIC design and embedded systems, announced today at GLOBALFOUNDRIES (GF) annual Global Technology Conference (GTC) that CSEM is developing ultra-low power Bluetooth Low Energy® (BLE), CMOS radar mmWave IP and embedded
machine-learning accelerators on GLOBALFOUNDRIES (GF) 22nm FD-SOI (22FDX®) platform.
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