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IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published in January 2019. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified
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Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including
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Moortec, provider of complete In-Chip Monitoring PVT Subsystems announced today that Credo has utilised Moortec’s Temperature Sensor and Voltage Monitor IP to optimise performace and increase reliability in their latest generation of SerDes chips.
Credo offers high-performance, mixed-signal semiconductor solutions including advanced serializer-deserializer (SerDes) IP and interconnect
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its multi-protocol video interface IP on UMC 28nm HPC. The Multi-Protocol Video Interface IP solution supports both transmitter (TX) and receiver (RX) featuring a reduced silicon footprint ideal for state-of-the-art panel and
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Beckermus Technologies was founded in 1998 and serves as an Excellence Center in the field of “Bare Die” assembly services for micro-electronic and micro-optical systems. Beckermus Technologies has been playing a vital role in the lifecycle of many products, for numerous companies worldwide, from early prototypes to mass production.
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CoreHW releases an IP library with over 200 silicon verified IP. Silicon proven solutions allow fast end-product development and implementation. The IP library gives a comprehensive look to company’s IP range and makes it easier and faster for customers to start their ASIC design process.
The IP listed in
Power, performance and area (PPA) are three core competencies on which an ASIC design is evaluated. In an ideal world, ASIC designers strive to improve the performance of their design in a minimum possible silicon area with lowest possible power dissipation. However, there exists a trade-off between these three key
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The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding and lithography equipment market for the MtM industry is a small niche representing millions of dollars. However, megatrend markets push MtM devices to new levels of complexity, resulting in big
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Bangalore, India – Nov 30, 2018 – Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, received the Software Technology Parks of India (STPI) award for being the Highest Exporter – ITES in the Hubli Region. Sankalp Semiconductor has consecutively fourth time won
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IC Insights revised its outlook for total semiconductor industry capital spending and presented its forecast of semiconductor capex spending for individual companies in its November Update to The McClean Report 2018, which was released earlier this month.
Samsung is expected to have the largest capex budget of any IC supplier again in