Burn-in is a mode of semiconductor testing, where the device under test (DUT) is subjected to high stress which maybe in terms of higher voltage, or higher ambient temperature or excessive operating frequency. Burn-in testing is primarily aimed at reducing the time to failure for a device without changing the device failure characteristics before shipping the chip to the customer.
Subjecting the chips to higher ambient temperature is an example of static burn-in testing, while in some cases, the DUT may also be exercised electrically by applying clock signals of various frequencies. This burn-in test is referred to as dynamic burn-in testing.
