Fan out wafer level package (FOWLP) is a new type of wafer level package with fan out capabilities. FOWLP allows spreading the wafer bumps across a substrate which is applied to the wafer. The substrate is essentially bigger than the die therefore the die spacing is more relaxed.
In FOWLP the original wafer is being sliced and then reconstituted by spreading the dies from each other and then applied a thin film material that acts like a substrate. The FOWLP substrate is essentially connecting the die’s pads to the bumps.
FOWLP is an attractive package technology both low cost packaging and for applications that superior electrical performance (RF).
The FOWLP package is targeted to high volume applications and supported by all major IC packaging companies.
