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Wafer Dicing

March 24, 2019, anysilicon

Individual silicon chips are referred to as dies. The process of wafer dicing refers to when these dies are separated from each other on the semiconductor wafer by scribing, cutting by laser, or physically sawing the areas between the individual die to separate them. These areas are referred to as dicing streets or scribe lines. This process is carried out after the wafer has been processed. Before dicing the wafer, the wafer is attached to a tape and mounted on top of a tool face down to maintain quality and avoid any mishaps or wrong cuts.

 

After the wafer has been diced and the dies have been separated, the chips are encapsulated into chip carriers or any suitable packaging which will make them ready to be used in various circuits.

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