Find ASIC Vendors

Wire Bonding

December 11, 2014, anysilicon

Wire bonding is a relatively simple and low cost process of connecting die pads to a substrate, a leadframe or a PCB as part of the assembly process. Today, wire bonding is used in most of semiconductor products.

Recent Stories

CEO Talk: Tim Tiek of Bruco Integrated Circuits

CEO Talk: Tim Tiek of Bruco Integrated Circuits

2014-2024 Semiconductor Foundries Sales Forecast

2014-2024 Semiconductor Foundries Sales Forecast

48V Ecosystem and Power IC Packaging Trends

48V Ecosystem and Power IC Packaging Trends

Talking Sense with Moortec – ‘From Moore’s Law to Moortec’s Law!’

Talking Sense with Moortec – ‘From Moore’s Law to Moortec’s Law!’

IC Insights Bulletin: Nvidia’s $40 Billion ARM Purchase Will Test Current M&A “Ceiling”

IC Insights Bulletin: Nvidia’s $40 Billion ARM Purchase Will Test Current M&A “Ceiling”

Secure-IC is ready for ASIL B or ASIL D levels projects with its Securyzr integrated Secure Element

Secure-IC is ready for ASIL B or ASIL D levels projects with its Securyzr integrated Secure Element

Semiconductor R&D outsourcing model in times of Covid-19 and the Sino-US trade war (Part 2)

Semiconductor R&D outsourcing model in times of Covid-19 and the Sino-US trade war (Part 2)

CAST and Fraunhofer IPMS Introduce CAN XL Bus Controller IP Core

CAST and Fraunhofer IPMS Introduce CAN XL Bus Controller IP Core