Taiwan Semiconductor Manufacturing Company (TSMC) today announced that customer inquiries for its next-generation 2nm process are exceeding even those for its already successful 3nm technology. This exceptional demand underscores the industry’s confidence in TSMC’s technological leadership and its ability to meet the rapidly growing needs of the AI and high-performance computing (HPC) markets.
TSMC’s 2nm process, slated for volume production in 2025, is expected to replicate or surpass the success of its 3nm predecessor. Tech giants such as Apple, NVIDIA, and AMD are anticipated to be among the first customers for this advanced node. To meet the substantial demand, TSMC is significantly expanding its 2nm capacity. The company’s fabs in Hsinchu’s Baoshan and Kaohsiung are on track to achieve a combined monthly capacity exceeding 100,000 wafers by 2027.
This aggressive capacity expansion reflects TSMC’s commitment to providing the industry’s most advanced semiconductor technologies and solidifies its position at the forefront of the next generation of computing. The strong interest in 2nm further validates TSMC’s technological leadership and its ability to meet the evolving needs of its customers in the rapidly expanding AI and HPC sectors.
