Understanding High Temperature Storage Life (HTSL) in IC Qualification

For ASIC or IC, there are recommended environmental conditions for their storage which allows them to perform at proper functionally. However, it is well known that storage may not always be close to the recommended standard. This is where the high temperature storage life testing (HTSL reliability testing) comes into play, testing the parameters of the device, so that it can be determined what damage will result from being stored in less-than-ideal conditions.


The HTSL test in response to how many businesses and consumers may put away an electronic device for a considerable length of time in conditions that may include exposure to high temperature.


This type of test is used to screen, monitor, qualify, or evaluate all ASICs, which means they have no moving parts. The test itself is used to determine the overall effects of temperature and the passage of time for devices that are stored. This means that the device is tested to see how it reacts to being stored in high or low temperature environments along with the time it may spend in storage before being used. This includes data retention failure mechanisms or non-volatile memory devices.


ASICs are baked in a chamber at an extreme temperature and humidity for various lengths of time. Temp = 150°C / Time = 1000 hours. 

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