Vanguard International Semiconductor Corp (VIS) and Episil Technologies Inc. announced today a strategic partnership to build an 8-inch silicon carbide (SiC) wafer fabrication facility in Taiwan. The collaboration, facilitated by an equity acquisition deal, will see VIS acquire a 13% stake in Episil for NT$2.48 billion (US$77.1 million).
The joint venture marks a significant step towards meeting the growing demand for SiC chips, which offer superior performance and efficiency compared to traditional silicon chips. SiC chips are crucial for applications in electric vehicles, AI data centers, green energy storage, and industrial devices.
VIS, a leading contract chipmaker specializing in power management chips and display driver ICs, will subscribe to 50 million Episil shares at NT$49.6 each through a private placement, representing a 20% discount to Episil’s closing price yesterday.
Episil will use the proceeds to fund the construction of the 8-inch fab, which is expected to begin production in the second half of 2026. The facility will focus on producing SiC wafers, a key component in the manufacturing of SiC chips.
The joint venture will leverage the expertise of both companies, combining VIS’s experience in semiconductor manufacturing with Episil’s focus on SiC technology. This collaboration is expected to accelerate the development and adoption of SiC chips, contributing to the advancement of key industries like electric vehicles and renewable energy.
