China
IC back-end processing company which provides wafer and IC testing, wafer back-end processing, COB/COF/MCM, SMT & module assembly, and IC packaging services. Testing services include test program development, probe card manufacturing, and analog, digital, mixed signal, complex SOC, and ASIC wafer and IC testing.
Rapid prototyping and mass production service, from wafer (including MPW wafer) to the COB/SMT sample, or to the finished product.
R&D department is capable of designing complete product solutions according to customer expectations, and is also experienced in production line automation.