Switzerland
Advanced Silicon is a fabless IC design company specialized in the design and delivery of cutting edge mixed-signal ICs, more particularly custom ASICs and ASSPs products in high-end markets such as Medical, Industrial, Gaming and Avionic.
The company has a strong core IP and expertise in smart peripheral SOCs (System-On-Chips) since it was founded in year 2000. With its complete supply chain and strong production network in Taiwan, it offers turnkey IC solutions using world class foundry service, packaging, and testing companies.
Typical IC products are High-Voltage controllers for power applications such as motor control and power converters, High-Voltage drivers for Switches and MEMs, capacitive controllers for PCAP touch sensors, and ultra-low noise multi-channel sensing AFEs for Photonic applications such as X-RAY, Molecular and IR imaging.
We offer ASIC Design services from specification start till product End-Of-Life. We support ASIC products with demanding life cycles requirements up to 15 years. Our ASIC Design team is specialized in smart peripheral SOCs (System-On-Chips) with the following typical architectures and combining on the same silicon:
Both architectures communicate with the external application environment through general purpose interfaces such as high-speed LVDS, USB, I2C, and SPI and use general purpose IP blocs from our proven library such as voltage references and power management units.
Our Embedded Firmware team is specialized in the design and development of state-of-the-art signal and image processing algorithms for highly constrained embedded devices. Truly integrated firmware design together with our custom ASIC controllers and digital Hardware accelerators enables us to provide highly efficient embedded and edge computing solutions for a wide variety of Image and Signal applications.
We have experience on-device implementation of adaptive filtering, denoising, whitening, and other models-based filtering techniques for Image/signal pre-processing to further enhance the quality of sensor readouts in presence of strong interferences which are typical of industrial or medical applications.
Our image processing controllers include robust image segmentation, active area, and shape detection along with continuous tracking of up to 128 shapes simultaneously. Tracking and trajectory predictions based on k-means clustering and predictive filters enable our image processing controller to individually detect, assign and track all the shapes reliably. We use fast object detection and region-based classifications using convolutional filters to reliably classify the true events in very harsh environments.
Our latest innovative algorithms implementation uses recurrent neural net (RNN) for adjacent channels of active pixels and enables our platforms to reach best-in-class performance in precise subpixel localization typically for a tip on a large pixel grid (< 0.45mm for a 1cm grid) even for very large pixel grids unparallel to none. We use Kalman particle filters for tracking and model-based trajectory predictions to reach an astonishing naturally feeling movements.
Advanced Silicon offers within its facilities duplicated testing equipment for engineering test program development and for optimized efficiency. Our test engineers will work closely during the design phase with the ASIC designers to ensure a high-quality Design-For-Test (DFT) development flow.
The wafer testing in production is performed in our partners facilities on 8” and 12” Automated Test Equipment (ATE) and is based on a golden test program qualified on the engineering samples used in the duplicated test equipment.
Our testing equipment is highly specialized in multi-channel probing capabilities enabling the testing in parallel of up to typically 1024 input-output channels.
We offer a wide choice of packaging technologies ranging from state-of-the-art QFN to complex flip-chip BGA. We are also highly specialized in the development and production of advanced packaging solutions using COF (Chip-On-Film) technologies.
Our BGA packaging solutions feature simple high-ball count die assembly and complex MCM (Multi-Chip-Assembly) schemes. We also offer SIP (System-In-Package) technology for demanding high-density systems with passive components inside the packaging solution.
Our COF packaging solution offers simple or multi-die flip-chip assembly options with a high-density pitch down to 32um on the ILBs (Inner Lead Bonds) and OLBs (Outer Lead Bonds) side. It is the most advanced and convenient packaging technology solution for the assembly of our high-pin count ASICs bridging between a standard PCB application board to any other substrate such as glass material with high density leads where standard soldering process is not possible and the use of ACF (Anisotropic Conductive Film) bonding is mandatory.
Advanced Silicon standard Qualification Flow is based on the JEDEC, MIL and IEC standards depending on the qualification requirements of our customers.
Upon specific request of very low FIT (Failure-In-Time) rate requirements from our customers we offer advanced burn-in tests to guarantee a high-quality production service with very low defect rates
Advanced Silicon provides continuous support during production to its customers with a proven 8D RMA flow. Upon approval of an RMA case, we perform in depth failure analysis of the returned parts failing with the following in-house capabilities
Beyond our in-house capabilities, Advanced Silicon has established a long-term partnership with dedicated failure analysis entities providing advanced failure analysis services such as
Which enables our back-end PE team providing the best quality support to our customers during production.
