Germany
AEMtec is a leading global specialist for the development and production of a variety of precision optoelectronic products, including components, subsystems, modules and complete systems. Precision optoelectronic assembly services including; Hybrid Electronic and Optical Assemblies, Micro-Optics, Imaging Arrays, VCSEL Assemblies, Sensor Systems, Optical MEMs, wafer bumping and balling as well as active and passive alignment.
Extensive know-how in a broad range of packaging and assembly technologies on multilayer and complex substrates allows us tu turn innovative product ideas into functional and reliable solutions. AEMtec provides a complete service portfolio all along the value chain to ensure ideal conditions. Customers gain value from the various assembly technologies offered from a single source. Rapid time-to-market of products secures customers’ competitive advantage.
Feasibility Study
Risk Analysis
DFM Analysis
Process and Test Development
Supply Chain Management
Traceability Concepts
Rapid Prototyping
Qualification and Industrialization
Pilot Production and Series Production
Cleanroom environment (ISO/ class 5/100 to 8/100)
Wafer Back-End: UBM, Solder Ball Attach, Gold Stud Bumping
Chip on Board
Flip Chip
High Precision Placement
SMT
Box Build
Test and Analysis Equipment
Under bump metallization (UBM)
Solder balling
Fully automatic: Dicing, cleaning and UV-exposure
Au-stud bumping