AEMtec is a leading global specialist for the development and production of a variety of precision optoelectronic products, including components, subsystems, modules and complete systems. Precision optoelectronic assembly services including; Hybrid Electronic and Optical Assemblies, Micro-Optics, Imaging Arrays, VCSEL Assemblies, Sensor Systems, Optical MEMs, wafer bumping and balling as well as active and passive alignment.


Extensive know-how in a broad range of packaging and assembly technologies on multilayer and complex substrates allows us tu turn innovative product ideas into functional and reliable solutions. AEMtec provides a complete service portfolio all along the value chain to ensure ideal conditions. Customers gain value from the various assembly technologies offered from a single source. Rapid time-to-market of products secures customers’ competitive advantage.


Development and Process Engineering

Feasibility Study

Risk Analysis

DFM Analysis

Process and Test Development

Supply Chain Management

Traceability Concepts

Rapid Prototyping

Qualification and Industrialization

Pilot Production and Series Production

High Standard of Technological Equipment

Cleanroom environment (ISO/ class 5/100 to 8/100)

Wafer Back-End: UBM, Solder Ball Attach, Gold Stud Bumping

Chip on Board

Flip Chip

High Precision Placement


Box Build

Test and Analysis Equipment

Wafer Back-End Services

Under bump metallization (UBM)

Solder balling

Fully automatic: Dicing, cleaning and UV-exposure

Au-stud bumping