Alter Technology
UK
We provide contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to assembled product.
Our process and design IP and know-how enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with any new product development.
Our expertise in semiconductor packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture.
Services
Package Design
Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity for semiconductor devices. We have extensive design capability in all these areas for a large number of product types and markets.
Assembly Processes
We provide the following assembly processes:
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