Amkor Technology Inc.

Amkor is an industry leader in finding IC packaging solutions to meet complex requirements. To serve the diverse needs of our world class semiconductor manufacturers, Amkor offers more than 3000 different package formats and sizes. Packages range from traditional leadframe ICs for through-hole and surface mounting, Power Discretes for the automotive and industrial markets, to those required in high pin count and high-density applications such as stacked die, wafer level, MEMS & sensors, flip chip, 2.5D/3D TSV, 3D packaging. These broad product offerings allow Amkor Technology to be a single source for our customers’ total IC packaging requirements.

As technology rapidly advances, and consumers demand more customization, Amkor has taken the next step forward in packaging with the development of new technologies to enhance, and sometimes drastically change, the packaging arena. With one of the strongest R&D teams in the industry, and over 300 leading semiconductor packaging technologists, Amkor is focused on design and development efforts to further advance the value of packaging and provide the total solution for our customers.

We have been instrumental in the development of almost every new packaging technology advance, including thin package formats and BGA packages. Amkor is now focusing on developing technology such as 2.5D/3D TSV, Through Mold Via (TMV®), System in Package (SiP), Chip on Wafer (CoW), Chip-on-Chip (CoC), copper pillar, and improving interconnect with flip chip technology and 3D solutions like stacked die packages. We also have teams focused on the latest industry developments including packaging options for gallium arsenide and silicon germanium, and the emerging markets of photonics, MEMS, and wafer level fan-out packaging.

Amkor, leading the evolution of new packaging technologies.

Amkor’s design engineers are trained experts and experienced in the latest design tools and packaging technology. We process thousands of new package designs for customers every year for existing or next-generation products. Our world class design centers are strategically located in the United States, Korea, China, Philippines, Portugal and Taiwan to reduce design cycle times and provide customers with expert advice. Amkor incorporates Design for Cost (DFC) and Design for Manufacturing (DFM) when Designing for Performance (DFP). Our highly trained and experienced design staff can provide leadframe, laminate or wafer level design services.

With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.

Amkor has an extensive equipment fleet and continues to invest in new capabilities required to test the latest devices. Through early engagement in each customer’s product lifecycle, Amkor defines test strategies and intelligent equipment selection to provide differentiated test solutions.

As the demand for outsourcing continues to grow and supply chains continue to shorten, Amkor is committed to providing an increased role in the customers’ value chain. To this end, Amkor offers a full line of value-added semiconductor services.

Amkor can add value by becoming involved in a customers’ projects as early as possible. By using advanced specialized package characterization services, the company facilitates a better understanding of how a device will react electrically, mechanically and thermally once inside a finished package. Having this knowledge at the beginning of the design phase helps designers make better decisions in developing a superior performing end product.

Getting involved at the die design phase also allows Amkor’s Packaging Design Center to create the optimum package for any device. IC design experts can advise on how specific aspects of the device will interact with a given package design to help optimize the device performance.

Add to this, Amkor’s expertise and experience in providing wafer probe or test solutions for the entire spectrum of integrated circuits through geographically diverse test service facilities. Located worldwide for customer convenience, Amkor offers IC test services for any device, from simple digital logic, complex ASIC, high speed digital, memory, mixed signal 5G and mmWave devices.

These semiconductor services along with die processing & inspection, package signal integrity analysis, failure analysis, qualification testing, engineering support and an online customer center combine to make Amkor a valuable link in the customers supply chain.