Semiconductor Latest News

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TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant

TSMC building

[May-15-2025] – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, is dramatically expanding its manufacturing capacity both domestically and internationally in response to growing demand and ongoing tariff pressures. The company plans to construct nine new facilities in 2025 alone, a significant acceleration of its expansion strategy.
 
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Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape, Says TrendForce

May 13, 2025 —- TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation. While ASE holdings and Amkor maintained leading positions, OSAT providers from China, such as JCET and HT-Tech,

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Adani Enterprises and Tower Semiconductor Pause $10 Billion Chip Project in India

Mumbai, India – May 2, 2025 – Adani Enterprises Ltd., led by Indian billionaire Gautam Adani, and Israel-based Tower Semiconductor have paused discussions on their proposed $10 billion semiconductor fabrication project in Maharashtra, India. The decision follows an internal strategic review, as reported by Reuters.
 
Announced in September 2024,

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Demonstrating DB HiTek Chips Integrating Weebit ReRAM at PCIM 2025

HOD HASHARON, Israel and SEOUL, South Korea – May 1, 2025 – Weebit Nano Limited (ASX:WBT) (Weebit), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and tier-1 semiconductor foundry DB HiTek will show the first demonstration of DB HiTek’s Bipolar-CMOS-DMOS (BCD) silicon integrating Weebit’s

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Imec coordinates EU Chips Design Platform

LEUVEN (Belgium), 29 April, 2025 — A consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform. Funded by Chips JU, the platform will facilitate access to advanced semiconductor design infrastructure, training, and capital for fabless semiconductor

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Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025, SEMI Reports

MILPITAS, Calif. — April 29, 2025 — Worldwide silicon wafer shipments increased 2.2% year-on-year (YoY) to 2,896 million square inches (MSI) from the 2,834 MSI recorded during the same quarter of 2024, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry. Sequentially, shipments

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SkyeChip Joins Intel Foundry Accelerator IP Alliance

press release

Penang, Malaysia, 30 April 2025 –– SkyeChip Berhad, a Malaysian integrated circuit (IC) design company specialising in high-performance silicon IP, has announced its participation in the Intel Foundry Accelerator IP Alliance. This strategic collaboration enables the company to support Intel Foundry customers by delivering high-quality IP optimised for Intel Foundry’s

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X-FAB First Quarter 2025 Results

April 29-2025 — TESSENDERLO-HAM, Belgium-Regulatory News:
X-FAB (BOURSE:XFAB):
 
Highlights Q1 2025:

Revenue was USD 204.1 million, down 6% year-on-year (YoY) and up 8% quarter-on-quarter (QoQ)
Excluding the impact from revenue recognized over time (IFRS 15), revenue was USD 202.3 million, well within the guided range of USD 195-205 million
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STMicroelectronics Published Q1 2025 Financial Results

STMicroelectronics has announced its financial results for the first quarter of 2025, reflecting both the challenges of a shifting market and the company’s strategic transformation efforts.

 
This memo summarizes STMicroelectronics’ Q1 2025 financial results, as announced. While revenues were down 27.3% year-over-year to $2.52 billion, aligning with

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Intel Expands Foundry Ecosystem With TSMC, UMC, and Taiwanese IP Partners

Intel’s new CEO, Lip-Bu Tan, concluded his first earnings call, signaling a strong commitment to the company’s transformation. This transformation includes a strategic blend of internal manufacturing and external partnerships, notably with TSMC. Intel’s upcoming Nova Lake CPU will leverage both Intel’s own fabs and TSMC’s manufacturing capabilities, optimizing production

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