ams OSRAM

At ams OSRAM, we understand that every successful ASIC (Application Specific Integrated Circuit) project begins with an idea. We invite you to share your concepts and concerns with us. Our team of experts will swiftly assess its feasibility and identify possible implementations.

– Regardless of whether this is a new generation of your product or an entirely new concept, our engineers will evaluate your requirements alongside our technical capabilities to determine the feasibility of your product accurately.

– Initial feasibility assessment, including unit-price estimation, for products utilizing standard semiconductor packages can be completed within three weeks after receiving your requirements.

To ensure confidentiality, we will begin with a signed non-disclosure agreement (NDA). Following that, our engineering teams will meticulously evaluate the feasibility of your concept using our advanced technologies.

For standard IC products, we provide an initial feasibility assessment within three weeks. All we require from you are your core product requirements, anticipated annual volumes, preferred timeframe for the semiconductor package, and your development timeline. We will handle the rest, even generating a comprehensive engineering and commercial quote for your product.

ams OSRAM cultivates a spirit of true partnership. We believe in working closely with our customers to gain a profound understanding of their needs and transform their innovative concepts into reality. This collaborative approach unlocks the full potential of light and sensor technologies, propelling your project toward success.

– Share your concepts and concerns with us and we will explore it further for you, addressing the potential knowledge gaps and supporting your creativity with our expertise.

– We work hand-in-hand with you to define the implementation details, project setup, and timeline, all meticulously tailored to your specific requirements.

– You can optimize your scheduling and costs by choosing between a fast-track approach that prioritizes speed and cost efficiency or a cost-optimized solution focused primarily on reducing expense rather than promoting speed.

– Qualification requirements are driven by our customers. We follow the highest quality standards and can tailor qualification plans based on your reliability needs, to prevent over-engineering and streamline costs and time to market.

Customization is the cornerstone of every semiconductor chip that we develop. We are here to help you translate your idea into a tangible product. Our highly skilled senior engineers collaborate closely with you to transform your requirements into a detailed device specification. We go beyond simply fulfilling your specifications. The extensive experience of ams OSRAM means we can identify alternative solutions that perfectly address your unique challenges. Additionally, our own CMOS fabrication plant, coupled with collaborations with leading CMOS manufacturers, empowers us to streamline and cost-optimize the prototyping process through cybershuttles and multi-project wafer (MPW) initiatives.

ams OSRAM offers industry-leading expertise in ASIC design. Our global network of analog, digital, verification, and process engineers, spread across 40+ research and development centers, is equipped to tackle any demanding ASIC project. We combine comprehensive design capabilities in analog, mixed-signal, and digital techniques, followed by rigorous verification throughout the design phase.

– Our CMOS processes enable semiconductor devices, like photodiodes and low-noise transistors, to be customized to meet sophisticated customer needs.

– We ensure precise modeling to accurately reflect simulation in reality.

– If desired, we provide chips as bare dies on foil or packaged in ceramic housing within a week after fab-out day.

– Once packaged, your products are assessed for full functionality and specification compliance.

Owning our CMOS fabrication plant gives us a unique advantage, enabling close collaboration between design and process engineers to fine-tune semiconductor devices. This ensures the perfect process option tailored to your specific application. Our Process Design Kit (PDK) offers resources for developing complex analog and mixed-signal designs, including accurate simulation models, libraries, IP blocks, and verification rule sets. Our dedicated teams in Austria provide precise models and comprehensive technical support.

Our “first-time-right” approach ensures high-quality results, with designs undergoing rigorous verification at multiple stages, supported by top-of-the-line CAD software. Active customer participation in design reviews ensures the final product meets all requirements. We maintain consistent versioning of models and tooling to ensure smooth unification and verification of the block in the pre-tapeout phase.

Every design undergoes extensive validation in our state-of-the-art laboratories, equipped with certified and calibrated equipment. This high level of automation enables efficient data tracking and minimized development time. Where time is constrained, we can deliver the first samples in ceramic packages within a week of wafer manufacturing.

ams OSRAM is your trusted partner throughout the entire ASIC lifecycle, including manufacturing, assembly, and testing. We collaborate with world-renowned semiconductor foundries and assembly facilities, implementing a dual-sourcing strategy for guaranteed reliability.

– Access to our own CMOS manufacturing plant enables us to offer a wide range of process nodes.

– Advanced 3D wafer-level integration technologies, like Through Silicon Vias (TSVs), die stacking, and wafer-to-wafer bonding, elevate your technical offerings.

– We ensure complete redundancy in every manufacturing step, guaranteeing true double sourcing of your products.

Our partnership with TSMC ensures full compatibility across CMOS manufacturing lines, guaranteeing product consistency. Our state-of-the-art 8-inch semiconductor fabrication plant near Graz in Austria offers CMOS processes tailored for automotive and industrial applications, incorporating high-voltage capabilities and ultra-low-noise variants suitable for precision front-end electronics. Our facility also provides advanced optical functionalities.

We leverage advanced packaging techniques like TSVs and wafer-to-wafer bonding. Our expertise in wafer post-processing allows us to integrate optical filters and Anti-Reflective Coatings (ARCs), improving optical sensor performance.

We collaborate with top-tier assembly houses worldwide to provide the best timeline and price for your project. Our experienced teams support you through the prototyping stage, offering standard and customized packages. This approach minimizes errors and unlocks the full potential of CMOS technology by mitigating crosstalk, parasitic components, and noise sources. Each standard package has two qualified sources to prevent supply chain disruptions.

ams OSRAM operates test centers in Austria and the Philippines, staffed by dedicated test development engineers. Utilizing state-of-the-art testing equipment, we guarantee dual-sourcing and implement best practices in Design for Test (DFT). This approach allows for product optimization from the earliest stages. Our high test coverage and optimized test times ensure exceptional product quality at competitive prices.

At ams OSRAM, quality and reliability are paramount. We employ rigorous reliability testing before releasing any product for mass production. Our highly qualified teams ensure that our own products meet strict standards – and so do those of our suppliers.

– Not only do we adhere to industry standards for compliance with RoHS and REACH regulations, but also set higher internal standards by rigorous control of our product i.e. with regard to the content of halogen materials.

– We ensure completion of 3D and 8D reports within three working days and 14 calendar days, respectively, regardless of whether you are an automotive customer or not.

– For our non-automotive customers, we provide on-demand Production Part Approval Process (PPAP) services.

We also empower our customers to define their quality requirements. Whether following industry standards or establishing customized protocols with expert support, we collaborate to create a tailored qualification plan. Our unwavering commitment is to deliver zero-defect products.

We prioritize achieving a stable supply chain. Our global network of experts ensures adherence to the highest quality standards. Through close collaboration with our customers, we proactively plan demand to eliminate potential supply bottlenecks.

For select customers, we offer the option of wafer buffer stock to further stabilize the supply of critical products. We are also open for long-term agreements in which supply of product is guaranteed for a given number of years at an agreed volume level. This gives our customers peace-of-mind and assurance that even during times of tight supply they can count on getting the product they need. 

Furthermore, ams OSRAM ensures all products are rigorously qualified to withstand any relevant transportation conditions. This includes stringent transport simulation requirements within our product qualification plans. This meticulous approach guarantees our customers receive their products in pristine condition.