Aptasic

Switzerland

aptasic Logo

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

 

 

Services

Consulting

  • DfX: design for test (DfT), design for manufacturing (DfM), design for assembly (DfA)
  • Project management

Electrical Test Implementation

  • Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radio frequency (RF)
  • Multi-site wafer probing at cold/room/hot temperature (-40C / 150C)
  • Parallel package test at cold/room/hot temperature (-40C / 150C)

Screening and Qualification

  • Full range of procedures accordingly to JEDEC / MIL-883 standards

Industrialization

  • Prototyping of small series (using ProtoPack)
  • Production ramp-up optimization
  • Manufacturing in mass production
  • Tape and reel (T&R)

Wafer Supply

  • Supply from major fab’s
  • Inventory & forecast management
  • Safety stock management

Manufacturing

  • Wafer level chip scale packages (WLCSP) with RDL, passivation and bumping
  • Back-grinding, sawing, wafer molding
  • Standard (lead-less and leaded) packages: DFN, QFN, QFP, TQFP, LQFP, MSOP, QSOP, SOIC-N, SOIC-W, TSSOP-4.4,TSSOP-6.1, SSOP, PDIP, PLCC.
  • Laminate substrate packages: BGA, LGA.
  • Discrete packages: SOT-23, SOT143, SC70, TSOT, SOT666, SOT223, TO-92, SOT89, SOT323.
  • Specific packages: TO-220, DDPACK, Clear pkgs, PSOP.
  • Multi die packages: Stacked, Flip-chip, Multi chips, System in Package (SIP), Specific custom package development,
  • PCBA and COB modules.
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.